What Originates the Dielectric Permittivity of Silicate-Silsesquioxane Hybrid Thin Films?

Silicate-silsesquioxane or siloxane-silsesquioxane hybrid thin films are strong candidates as matrix materials for ultralow dielectric constant (low-k) thin films. We synthesized the silicate-silsesquioxane hybrid resins from tetraethoxyorthosilicate (TEOS) and methyltrimethoxysilane (MTMS) through hydrolysis and condensation polymerization by changing their molar ratios ([TEOS]-[MTMS] ) 7:3, 5:5, and 3:7), spin-coating on Si(100) wafers. In the case of [TEOS]-[MTMS] ) 7:3, the dielectric permittivity value of the resultant thin film was measured at 4.30, exceeding that of the thermal oxide (3.9). This high value was thought to be due to Si-OH groups inside the film and more extensive studies were preformed in terms of electronic, ionic, and orientational polarizations using Debye equation. The relationship between the mechanical properties and the synthetic conditions of the silicate-silsesquioxane precursors was also investigated. The synthetic conditions of the low-k films have to be chosen to meet both the low orientational polarization and high mechanical properties requirements. Silicate-silsesquioxane or siloxane-silsesquioxane hybrid thin films have been investigated as promising materials for ultralow dielectric constant (low-k) thin films.1-4 In addition, they have also been regarded as one of the best matrix materials to provid