We have made a quantitative study about the thermal activation of thermal donors in high resistivity magnetic Czochralski silicon. The thermal donor activation has been performed through a thermal treatment at 430 1C up to a total time of 80min. The space charge density after each annealing step has been extracted from capacitance–voltage measurements. If the starting material is boron-doped p-type high-resistivity Czochralski silicon, the thermal donor generation process can be utilized in order to produce p+/n/n+ detectors. The last thermal process step, i.e. the sintering of aluminum, is intentionally carried out at the temperature where thermal donors are created. According to our results, we have improved the previously reported model ...
The depletion depth of irradiated n-type silicon microstrip detectors can be inferred from both the ...
A new method to map the thermal donor concentration in silicon wafers using carrier density imaging...
Silicon wafers grown by the Magnetic Czochralski (MCZ) method have been processed in form of pad dio...
A quantitative study about the thermal activation of oxygen related thermal donors in high resistivi...
Generation of thermal donor centres in oxygen-rich silicon doped with boron and aluminium acceptors ...
The Czochralski silicon (Cz-Si) has intrinsically high oxygen concentration. Therefore Cz-Si is cons...
We report on the design, manufacturing and first characterisation of pad diodes, test structures and...
A comparative study of thermally generated donor centers in boron and aluminum doped Czochralski sil...
In this work, the formation of donors in n-type high resistivity magnetic Czochralski-grown silicon ...
In this paper, the role of a direct plasma hydrogenation treatment and a subsequent air annealing at...
During cooling of Czochralski grown silicon ingots, thermal donors can be formed. These oxygen clust...
Thermal donors can form in Czochralski grown silicon during the cooling of the ingot. Base resistivi...
n+/p−/p+ pad detectors processed at the Microelectronics Center of Helsinki University of Technology...
The kinetics of thermal donor formation in Czochralski-silicon at ca. 450° C are explained by a sim...
In oxygen rich CZ-material, thermal donors (TD) are formed at elevated temperatures of approximately...
The depletion depth of irradiated n-type silicon microstrip detectors can be inferred from both the ...
A new method to map the thermal donor concentration in silicon wafers using carrier density imaging...
Silicon wafers grown by the Magnetic Czochralski (MCZ) method have been processed in form of pad dio...
A quantitative study about the thermal activation of oxygen related thermal donors in high resistivi...
Generation of thermal donor centres in oxygen-rich silicon doped with boron and aluminium acceptors ...
The Czochralski silicon (Cz-Si) has intrinsically high oxygen concentration. Therefore Cz-Si is cons...
We report on the design, manufacturing and first characterisation of pad diodes, test structures and...
A comparative study of thermally generated donor centers in boron and aluminum doped Czochralski sil...
In this work, the formation of donors in n-type high resistivity magnetic Czochralski-grown silicon ...
In this paper, the role of a direct plasma hydrogenation treatment and a subsequent air annealing at...
During cooling of Czochralski grown silicon ingots, thermal donors can be formed. These oxygen clust...
Thermal donors can form in Czochralski grown silicon during the cooling of the ingot. Base resistivi...
n+/p−/p+ pad detectors processed at the Microelectronics Center of Helsinki University of Technology...
The kinetics of thermal donor formation in Czochralski-silicon at ca. 450° C are explained by a sim...
In oxygen rich CZ-material, thermal donors (TD) are formed at elevated temperatures of approximately...
The depletion depth of irradiated n-type silicon microstrip detectors can be inferred from both the ...
A new method to map the thermal donor concentration in silicon wafers using carrier density imaging...
Silicon wafers grown by the Magnetic Czochralski (MCZ) method have been processed in form of pad dio...