The sustained progress of VLSI technology has altered the land-scape of routing which is a major physical design stage. For tim-ing driven routings, traditional approaches which consider only wire self capacitance become inadequate since the wire delay is affected more by coupling capacitance in ultra-deep submicron de-signs. Furthermore, the technology scaling dramatically increases the likelihood of the antenna problem in manufacturing and re-quests corresponding considerations in the routing stage. In this paper, we propose techniques that can be applied to handle the cou-pling aware timing and the antenna problem simultaneously during layer assignment which is an important step between global rout-ing and detailed routing. An improved p...
Abstract | Deep sub-micron e ects, along with increasing interconnect densities, have increased the ...
Ph.D. University of Hawaii at Manoa 2012.Includes bibliographical references.As the minimum feature ...
The inter-wire spacing in a VLSI chip becomes closer as the VLSI fabrication technology rapidly evol...
Abstract — As VLSI technology enters the ultra-deep submicron era, wire coupling capacitance starts ...
As fabrication technology keeps advancing, many deep submicron (DSM) effects have become increasingl...
As the CMOS technology enters the very deep submicron era, inter-wire coupling capacitance becomes t...
As VLSI technology enters the nanoscale regime, interconnect delay becomes the bottleneck of circuit...
As VLSI technology enters the nanoscale regime, the interconnect delay becomes the bottleneck of cir...
This paper addresses a delay-driven layer assignment problem with consideration of via delay and cou...
As VLSI technology moves to the 65nm node and beyond, interconnect delay greatly limits the circuit ...
Abstract- With the exponential reduction in scaling of feature size, inter-wire coupling capacitance...
With the exponential reduction in the scaling of feature size, inter-wire coupling capacitance becom...
As VLSI technology scales to deep sub-micron and beyond, it becomes increasingly challenging to ach...
[[abstract]]Antenna effect is an important issue that needs to be considered in the routing stage fo...
As technology advances, the effect of intra-module delays become less significant, while the effect ...
Abstract | Deep sub-micron e ects, along with increasing interconnect densities, have increased the ...
Ph.D. University of Hawaii at Manoa 2012.Includes bibliographical references.As the minimum feature ...
The inter-wire spacing in a VLSI chip becomes closer as the VLSI fabrication technology rapidly evol...
Abstract — As VLSI technology enters the ultra-deep submicron era, wire coupling capacitance starts ...
As fabrication technology keeps advancing, many deep submicron (DSM) effects have become increasingl...
As the CMOS technology enters the very deep submicron era, inter-wire coupling capacitance becomes t...
As VLSI technology enters the nanoscale regime, interconnect delay becomes the bottleneck of circuit...
As VLSI technology enters the nanoscale regime, the interconnect delay becomes the bottleneck of cir...
This paper addresses a delay-driven layer assignment problem with consideration of via delay and cou...
As VLSI technology moves to the 65nm node and beyond, interconnect delay greatly limits the circuit ...
Abstract- With the exponential reduction in scaling of feature size, inter-wire coupling capacitance...
With the exponential reduction in the scaling of feature size, inter-wire coupling capacitance becom...
As VLSI technology scales to deep sub-micron and beyond, it becomes increasingly challenging to ach...
[[abstract]]Antenna effect is an important issue that needs to be considered in the routing stage fo...
As technology advances, the effect of intra-module delays become less significant, while the effect ...
Abstract | Deep sub-micron e ects, along with increasing interconnect densities, have increased the ...
Ph.D. University of Hawaii at Manoa 2012.Includes bibliographical references.As the minimum feature ...
The inter-wire spacing in a VLSI chip becomes closer as the VLSI fabrication technology rapidly evol...