Selective Wafer Level Adhesive Bonding with

The work presented in this paper describes adhesive wafer level bonding with structured intermediate bonding material to achieve defined gaps. Benzocyclobutene (BCB) was used as bonding material. The patterning of this material was done either by dry etching of the BCB or by using a photosensitive version of the material. The process parameters needed to achieve a high bond quality have been investigated. 1