Film Capacitor Thermal Strategies Increase Power Density

Polypropylene dielectric film capacitors of varying types are used in large power systems due to their low heat dissipation and inherent reliability. This paper examines the construction of these capacitors for power applications and compares their heat rise performance with respect to electrodes, terminals, form factors, and packaging. Thermal behavior is measured for the internal construction of the capacitors and packaging with respect to various external cooling methods including convection, conduction and liquid cooling. In addition, heat induced from eddy currents from electromagnetic interference in relation to the position of the capacitors will also be considered. I