Approved for Public Release, Distribution Unlimited Zero-Level Packaging for RF MEMS Switches

Abstract: A process has been developed to effectively package RF MEMS switches using a new technique called wafer-level micro-encapsulation (WLµE). This technology is designed to be completely compatible with high-performance RF MEMS capacitive switch fabrication. This zero-level packaging technique has demonstrated excellent package added insertion loss through 110 GHz and sufficient protection to humidity