Add to ORKGA 3D Heterogeneous Sensor using a stacked chip is investigated. Optical Active Pixel Sensor and IR Bolometer detectors are combined to create a multispectral pixel for aligned color and infrared imaging. An acoustic and seismic micromachined sensor array obtains sound spectral and directional information. For the optical/IR imagers fault tolerant APS cells and software methods are used for defect avoidance. For the acoustic/seismic array spare detectors are combined with signal processing to compensate for changes in detector positions due to defects. The sensor fault distribution in turn impacts the defect avoidance in the fault tolerant TESH networked processors analyzing the sensor array. 1
MI-3 is a consortium of 11 universities and research laboratories whose mission is to develop comple...
A three-dimensional (3D) CMOS imager constructed by stacking a pixel array of backside illuminated s...
Reliability and manufacturing costs due to defects is a significant problem with image sensors and t...
Defect and fault tolerance is being studied in a 3D Heterogeneous Sensor using a stacked chip with s...
As solid-state image sensors become ubiquitous in sensing, control and photography products, their l...
Digital imaging detectors are growing larger in silicon area and pixel count, which increases fabric...
Solid-state image sensors develop in-field defects in all common environments. Experiments have demo...
Investigates systematic errors in active three-dimensional vision sensors. Time-of-flight sensors; P...
As the pixel counts of digital imagers increase, the challenge of maintaining high yields and ensuri...
The implementation of imaging arrays for System-On-a-Chip (SOC) is aided by using fault-tolerant lig...
A key advantage to the Active Pixel Sensor (APS) over the traditional charge coupled device (CCD) is...
As the sizes of imaging arrays become larger both in pixel count and area, the possibility of pixel ...
Novel 4-channel sensors for the detection of the components of visible and the near infrared light h...
The Fault Tolerant Active Pixel Sensor (FTAPS) corrects for defects by operating two pixel halves in...
MI-3 is a consortium of 11 universities and research laboratories whose mission is to develop comple...
MI-3 is a consortium of 11 universities and research laboratories whose mission is to develop comple...
A three-dimensional (3D) CMOS imager constructed by stacking a pixel array of backside illuminated s...
Reliability and manufacturing costs due to defects is a significant problem with image sensors and t...
Defect and fault tolerance is being studied in a 3D Heterogeneous Sensor using a stacked chip with s...
As solid-state image sensors become ubiquitous in sensing, control and photography products, their l...
Digital imaging detectors are growing larger in silicon area and pixel count, which increases fabric...
Solid-state image sensors develop in-field defects in all common environments. Experiments have demo...
Investigates systematic errors in active three-dimensional vision sensors. Time-of-flight sensors; P...
As the pixel counts of digital imagers increase, the challenge of maintaining high yields and ensuri...
The implementation of imaging arrays for System-On-a-Chip (SOC) is aided by using fault-tolerant lig...
A key advantage to the Active Pixel Sensor (APS) over the traditional charge coupled device (CCD) is...
As the sizes of imaging arrays become larger both in pixel count and area, the possibility of pixel ...
Novel 4-channel sensors for the detection of the components of visible and the near infrared light h...
The Fault Tolerant Active Pixel Sensor (FTAPS) corrects for defects by operating two pixel halves in...
MI-3 is a consortium of 11 universities and research laboratories whose mission is to develop comple...
MI-3 is a consortium of 11 universities and research laboratories whose mission is to develop comple...
A three-dimensional (3D) CMOS imager constructed by stacking a pixel array of backside illuminated s...
Reliability and manufacturing costs due to defects is a significant problem with image sensors and t...