Macromodeling of interconnects, discontinuities, and logic devices∗

This paper presents a systematic methodology for the Signal Integrity analysis of complete propagation paths from drivers to receivers. The various sub-structures typically found along these paths are drivers/receivers, transmission-line interconnects, and discontinuities like vias and connectors. We present here three main method-ologies aimed at the construction of accurate and efficient macromodels for each of these structures. The resulting macromodels are implemented in the IBM PowerSPICE circuit simulation environment. 1