The electrical properties of implanted p+ layers, shallow p+-n junctions, and a quasi-one-dimensional structure fabricated without masks by 20-keV Ga+ focused ion beam (FIB) on crystalline Si substrates were investigated in details. The distribution pro-file from SIMS showed discrepancies from LSS theory, which is considered to be the results of low beam en-ergy and high beam current density. From Hall effect measurements, the Hall drift mobility was 131 cm2 / V-sec, which is 62 % of the projected value due to remained defects after annealing. The I − V char-acteristics of p+-n junctions illustrated four distinct regions in the forward bias region and rising satura-tion current in the reverse bias region. Higher than expected leakage curren...
We report the detection of single ion impacts through monitoring of changes in the source-drain cur...
Ion-induced damage is an important issue in Ill-V and Si-Ge devices. The principal cause of damage i...
Electrical characteristics of ultra-shallow (similar to 90 nm) n(+)p junctions fabricated using plas...
Ultrashallow p(+)n junctions have been formed in silicon by low energy (5.5 keV) Ga+ implantation in...
Ultrashallow p + junctions formed by dual implanation of Ga and B with low-temperature rapid thermal...
The effects of post-ion implantation on the properties of P + N junction formed by BF2 ion implantat...
Proton-implanted and annealed p-type Si wafers were investigated by using both transmission electron...
[[abstract]]Gallium dopants have been introduced into micrometer and nanometer sized silicon-on-insu...
The developments over the last decade in Focused Ion Beam (FIB) instrument technology have reached ...
Depth profiles of the electrical quality of ion implanted and cw laser annealed p-n junctions in sil...
In this paper a method for studying p-n junctions is described. Different electron and ion beam char...
This thesis describes a systematic study of silicon dopant incorporation on various GaAs surfaces an...
The effects of focused-ion-beam-induced damage on electrical properties of n-type Si are investigate...
A nanocrystal Si (nc-Si) distributed in a narrow layer in the gate oxide close to the gate is synthe...
International audienceIt is well established that low energy B+ ion implantation into Ge- (or Si) im...
We report the detection of single ion impacts through monitoring of changes in the source-drain cur...
Ion-induced damage is an important issue in Ill-V and Si-Ge devices. The principal cause of damage i...
Electrical characteristics of ultra-shallow (similar to 90 nm) n(+)p junctions fabricated using plas...
Ultrashallow p(+)n junctions have been formed in silicon by low energy (5.5 keV) Ga+ implantation in...
Ultrashallow p + junctions formed by dual implanation of Ga and B with low-temperature rapid thermal...
The effects of post-ion implantation on the properties of P + N junction formed by BF2 ion implantat...
Proton-implanted and annealed p-type Si wafers were investigated by using both transmission electron...
[[abstract]]Gallium dopants have been introduced into micrometer and nanometer sized silicon-on-insu...
The developments over the last decade in Focused Ion Beam (FIB) instrument technology have reached ...
Depth profiles of the electrical quality of ion implanted and cw laser annealed p-n junctions in sil...
In this paper a method for studying p-n junctions is described. Different electron and ion beam char...
This thesis describes a systematic study of silicon dopant incorporation on various GaAs surfaces an...
The effects of focused-ion-beam-induced damage on electrical properties of n-type Si are investigate...
A nanocrystal Si (nc-Si) distributed in a narrow layer in the gate oxide close to the gate is synthe...
International audienceIt is well established that low energy B+ ion implantation into Ge- (or Si) im...
We report the detection of single ion impacts through monitoring of changes in the source-drain cur...
Ion-induced damage is an important issue in Ill-V and Si-Ge devices. The principal cause of damage i...
Electrical characteristics of ultra-shallow (similar to 90 nm) n(+)p junctions fabricated using plas...