The use of 0.6 vol. % single-walled carbon nanotubes in a poly(ethylene glycol)-based dispersion gave a thermal paste that was as effective as solder for improving thermal contacts. A thermal contact conductance of 20 · 104 W m-2 K-1 was attained. An excessive amount of nanotubes (e.g. 1.8 vol.%) degraded the performance, because of conformability loss. The nanotubes were more effective than hexagonal boron nitride particles but were less effective than carbon black, which gave a thermal contact conductance of 30 · 104 W m-2 K-1
The contact conductance of single, double, and triple thermal contacts of single-walled carbon nanot...
Thermal interface materials (TIMs) are a vital component of electronic packaging as they facilitate ...
Low thermal conductivity is a primary limitation in the development of energy-effi cient heat transf...
ABSTRACT The present work reports on an experimental study of carbon nanotube (CNT) arrays used for ...
Thanks to the IT technologies, our living−standard has improved greatly. Electronic devices thus bec...
Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages...
The power density of electronic packages has substantially increased. The thermal interface resistan...
The development of thermal interface materials (TIMs) is necessitated by the temperature drop across...
This paper describes an experimental study of thermal contact conductance enhancement enabled by car...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
The continued miniaturization and proliferation of electronics is met with significant thermal manag...
Carbon nanotube (CNT) forests or sheets coated and/or bonded at room temperature with one or more co...
Experimental and theoretical analyses were used to study the effect of thermal contact resistance in...
International audienceWith progress in microelectronics the component density on a device increases ...
With progress in microelectronics the component density on a device increases drastically. As a cons...
The contact conductance of single, double, and triple thermal contacts of single-walled carbon nanot...
Thermal interface materials (TIMs) are a vital component of electronic packaging as they facilitate ...
Low thermal conductivity is a primary limitation in the development of energy-effi cient heat transf...
ABSTRACT The present work reports on an experimental study of carbon nanotube (CNT) arrays used for ...
Thanks to the IT technologies, our living−standard has improved greatly. Electronic devices thus bec...
Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages...
The power density of electronic packages has substantially increased. The thermal interface resistan...
The development of thermal interface materials (TIMs) is necessitated by the temperature drop across...
This paper describes an experimental study of thermal contact conductance enhancement enabled by car...
The development of integrated circuitry has resulted in cheaper and more efficient computers being a...
The continued miniaturization and proliferation of electronics is met with significant thermal manag...
Carbon nanotube (CNT) forests or sheets coated and/or bonded at room temperature with one or more co...
Experimental and theoretical analyses were used to study the effect of thermal contact resistance in...
International audienceWith progress in microelectronics the component density on a device increases ...
With progress in microelectronics the component density on a device increases drastically. As a cons...
The contact conductance of single, double, and triple thermal contacts of single-walled carbon nanot...
Thermal interface materials (TIMs) are a vital component of electronic packaging as they facilitate ...
Low thermal conductivity is a primary limitation in the development of energy-effi cient heat transf...