Abstract — Noise induced by impedance discontinuities from VLSI pack-aging is one of the leading challenges facing system level designers in the next decade. The performance of IC cores far exceeds that of current packaging technology. The risetimes of IC signals require that the interconnect of the package be treated as transmission lines. As a result, impedance discon-tinuities in the package cause reflections which may result in intermittent switching of digital signals and edge time degradation, both of which limit system performance. The major cause of the impedance discontinuity in the package is the high inductance of the wire bond interconnect. To compensate for this problem, capacitance can be placed near the wire bond to reduce it...
Rapid advancement in electronics industry has resulted in many of the consumer based electronics bei...
This thesis proposes parasitic aware design techniques for concurrent Multi-Band impedance matching ...
International audienceThis communication deals with frequency behavior of orthogonal interconnect la...
When making an Integrated Chip, there is a process called contacting or bonding. In this process, th...
Wire bond technology is a matured and dominant interconnect methodology compared to other chip inter...
The modern era of technology contains a myriad of high-speed standards and proprietary serial digita...
Abstract—On-chip inductance is becoming increasingly impor-tant as technology continues to scale. Th...
Bondwires at millimeter-wave frequencies show a high impedance mismatch that limits their applicatio...
Signal integrity has become a major problem in digital IC design. One cause of this problem is devic...
With the onset of Gigahertz frequencies on integrated circuits (IC),inductance effects need to be ac...
This work is a comprehensive experimental investigation of chip to package wirebond interconnects fo...
Coverage of commercial communication standards such as GSM, UMTS, Wi-Fi and Wi-Max within a single t...
Abstract This paper discusses a design style that utilizes an area array of flip-chip solder bump co...
The study of Signal Integrity (SI) phenomena required the implementation of a specific test vehicle,...
This paper proposes a high current impedance matching method for narrowband power-line communication...
Rapid advancement in electronics industry has resulted in many of the consumer based electronics bei...
This thesis proposes parasitic aware design techniques for concurrent Multi-Band impedance matching ...
International audienceThis communication deals with frequency behavior of orthogonal interconnect la...
When making an Integrated Chip, there is a process called contacting or bonding. In this process, th...
Wire bond technology is a matured and dominant interconnect methodology compared to other chip inter...
The modern era of technology contains a myriad of high-speed standards and proprietary serial digita...
Abstract—On-chip inductance is becoming increasingly impor-tant as technology continues to scale. Th...
Bondwires at millimeter-wave frequencies show a high impedance mismatch that limits their applicatio...
Signal integrity has become a major problem in digital IC design. One cause of this problem is devic...
With the onset of Gigahertz frequencies on integrated circuits (IC),inductance effects need to be ac...
This work is a comprehensive experimental investigation of chip to package wirebond interconnects fo...
Coverage of commercial communication standards such as GSM, UMTS, Wi-Fi and Wi-Max within a single t...
Abstract This paper discusses a design style that utilizes an area array of flip-chip solder bump co...
The study of Signal Integrity (SI) phenomena required the implementation of a specific test vehicle,...
This paper proposes a high current impedance matching method for narrowband power-line communication...
Rapid advancement in electronics industry has resulted in many of the consumer based electronics bei...
This thesis proposes parasitic aware design techniques for concurrent Multi-Band impedance matching ...
International audienceThis communication deals with frequency behavior of orthogonal interconnect la...