DuPont Electronic Technologies

Technology development for embedding of passive components has been the subject of significant focus for OEMs, board fabs and material suppliers for the past few years. This has been driven primarily by the need to miniaturize portable devices like mobile phones though performance advantages accruing from embedding passives is also becoming increasingly significant. DuPont’s focus in the area of Embedded Passives has been on the development of resistive and capacitive materials for applications in organic substrates. The product family includes a wide range of materials viz. ceramic and polymer thick-film capacitor and resistor pastes for discrete embedded devices and filled and unfilled organic laminates for applications requiring planar capacitance. Previous publications have described the technology development involving standard thick-film and printed wiring boards (PWB) processes to embed thick-film ceramic passives in PWBs. This paper focuses on reliability of embedded thick film ceramic capacitors