On-chip global interconnections in very deep submicron technology (VDSM) ICs are becoming more sensitive and prone to errors caused by power supply noise, crosstalk noise, delay variations and transient faults. Error correct-ing codes can be employed in order to provide signal trans-mission with the necessary data integrity. We compared Dual Rail encoding versus Hamming with respect to power consumption of the bus wires themselves (passive capac-ity model) [13]. In this paper we analyze the contribu-tion of the active elements of both coding schemes. We first present a detailed analysis of the power consumption of an encoded bus, taking into account the bus wires (with mu-tual capacitances, drivers, repeaters and receivers), as well as the ...
As technology scales down to nanometer dimensions, coupling capacitances between adjacent bus wires ...
This paper describes a novel low-power coding methodology for buses. Ultra deep submicron technology...
Technology trends and especially portable applications are adding a third dimension (power) to the p...
On-chip interconnects in very deep submicrometer technology are becoming more sensitive and prone to...
On-chip interconnects in very deep submicrometer technology are becoming more sensitive and prone to...
As technology scales toward deep submicron, on-chip interconnectsare becoming more and more sensitiv...
On-chip interconnection networks for future systems on chip (SoC) will have to deal with the increas...
Now a day’s VLSI has become the backbone of all types of designs. Interconnect plays an increasing r...
Abstract. Crosstalk causes logical errors due to data dependent delay degrada-tion as well as energy...
Abstract — This paper introduces a new coding scheme that faces simultaneously different issues of i...
Capacitive crosstalk between adjacent wires in long on-chip buses significantly increases propagatio...
Abstract — This paper introduces a new coding scheme that faces simultaneously different issues of i...
none3Abstract—On-chip interconnection networks for future systems on chip (SoC) will have to deal w...
© 2017 IEEE. We propose an energy efficient error control code scheme which utilizes the intrinsic p...
Interconnection networks in Systems-On-Chip begin to have a non-negligible impact on the power consu...
As technology scales down to nanometer dimensions, coupling capacitances between adjacent bus wires ...
This paper describes a novel low-power coding methodology for buses. Ultra deep submicron technology...
Technology trends and especially portable applications are adding a third dimension (power) to the p...
On-chip interconnects in very deep submicrometer technology are becoming more sensitive and prone to...
On-chip interconnects in very deep submicrometer technology are becoming more sensitive and prone to...
As technology scales toward deep submicron, on-chip interconnectsare becoming more and more sensitiv...
On-chip interconnection networks for future systems on chip (SoC) will have to deal with the increas...
Now a day’s VLSI has become the backbone of all types of designs. Interconnect plays an increasing r...
Abstract. Crosstalk causes logical errors due to data dependent delay degrada-tion as well as energy...
Abstract — This paper introduces a new coding scheme that faces simultaneously different issues of i...
Capacitive crosstalk between adjacent wires in long on-chip buses significantly increases propagatio...
Abstract — This paper introduces a new coding scheme that faces simultaneously different issues of i...
none3Abstract—On-chip interconnection networks for future systems on chip (SoC) will have to deal w...
© 2017 IEEE. We propose an energy efficient error control code scheme which utilizes the intrinsic p...
Interconnection networks in Systems-On-Chip begin to have a non-negligible impact on the power consu...
As technology scales down to nanometer dimensions, coupling capacitances between adjacent bus wires ...
This paper describes a novel low-power coding methodology for buses. Ultra deep submicron technology...
Technology trends and especially portable applications are adding a third dimension (power) to the p...