Add to ORKGThis work presents a system of measuring grinding forces in precision applications. Several experiments demonstrate the performance in monitoring diamond wheel dressing, detecting workpiece contact, and process monitoring. The system appears promising for monitoring precision wafer grinding since this approach provides excellent sensitivity, high signal resolution, and good bandwidth
This project aims at gaining a better understanding of the mechanics of precision grinding of brittl...
The presented investigations deal with real-time evaluation and recording of vibrations and forces d...
High performance, brittle materials are the materials of choice for many of today's engineering appl...
The basic mechanical interdependencies in rotational grinding of silicon wafers are hardly known. Th...
iv In this work, an experimental setup on an ultraprecision machine tool is used to measure the mach...
Ductile grinding of silicon wafers with superior surface quality and TTV is one way of precision mac...
As the depth of cut in ultraprecision machining is usually less than the average grain size of a pol...
In the micro-grinding of single-crystal copper, the effect of crystallography becomes significant as...
Several obstacles complicate the task of optimizing a particular superabrasive grinding process. Gri...
This dissertation studies grinding of single-crystal Si with a vibration device. Si samples were cut...
The objective of this paper is to show the dependence relationship between the crystallographic orie...
Ductile streaks produced during diamond grinding of hard and brittle materials have aided the subse...
A grinding technique, referred to as the McCarter Superfinish, for grinding large size optical compo...
A sensor integrated “intelligent” diamond grinding wheel was designed and developed for in-process m...
International audienceThe micro/nanotribological behaviors of monocrystalline silicon wafers – displ...
This project aims at gaining a better understanding of the mechanics of precision grinding of brittl...
The presented investigations deal with real-time evaluation and recording of vibrations and forces d...
High performance, brittle materials are the materials of choice for many of today's engineering appl...
The basic mechanical interdependencies in rotational grinding of silicon wafers are hardly known. Th...
iv In this work, an experimental setup on an ultraprecision machine tool is used to measure the mach...
Ductile grinding of silicon wafers with superior surface quality and TTV is one way of precision mac...
As the depth of cut in ultraprecision machining is usually less than the average grain size of a pol...
In the micro-grinding of single-crystal copper, the effect of crystallography becomes significant as...
Several obstacles complicate the task of optimizing a particular superabrasive grinding process. Gri...
This dissertation studies grinding of single-crystal Si with a vibration device. Si samples were cut...
The objective of this paper is to show the dependence relationship between the crystallographic orie...
Ductile streaks produced during diamond grinding of hard and brittle materials have aided the subse...
A grinding technique, referred to as the McCarter Superfinish, for grinding large size optical compo...
A sensor integrated “intelligent” diamond grinding wheel was designed and developed for in-process m...
International audienceThe micro/nanotribological behaviors of monocrystalline silicon wafers – displ...
This project aims at gaining a better understanding of the mechanics of precision grinding of brittl...
The presented investigations deal with real-time evaluation and recording of vibrations and forces d...
High performance, brittle materials are the materials of choice for many of today's engineering appl...