Add to ORKGAs the impact of interconnect on IC performance and chiparea in deep submicron design increases, research activities on technologies for three-dimensional integrated circuits intensify. Nevertheless, there is not much work done on the automation of 3D-layout design. In this paper we survey slicing structures for 3D floorplans. We present an upper bound for the volume of such floorplans, which shows the usability of slicing structures for three-dimensional floorplanning
147 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2007.In Chapter 2, we present a fl...
129 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1987.In this thesis, a systematic ...
Floor-planning is a fundamental step in VLSI chip design. Based upon the concept of orderly spannin...
This is a preliminary study in which we use a genetic algorithm to solve the multiple layer floorpla...
The building blocks in a given floor-plan may have several possible physical implementations yie1din...
The first stage in hierarchical approaches to floorplan design determines certain topological relati...
[[abstract]]We consider in this paper the problem of slicing floorplan design with boundary-constrai...
Slicing tree has been an effective tool for VLSI floorplan de-sign. Floorplanners using slicing tree...
Abstract—Thermal issues are a primary concern in the three-dimensional (3D) integrated circuit (IC) ...
[[abstract]]In this paper, we will study floorplanning in 3-D integrated circuits (3D-ICs). Although...
Abstract — Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC)...
[[abstract]]In this paper, we will study fixed-outline floorplanning in 3D-IC. Although there is abu...
rently being developed to improve existing 2D designs by providing smaller chip areas and higher per...
A methodology of VLSI layout described by several authors first determines the relative positions of...
Dramatic improvements in circuit integration technologies have resulted in a huge increase in the co...
147 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2007.In Chapter 2, we present a fl...
129 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1987.In this thesis, a systematic ...
Floor-planning is a fundamental step in VLSI chip design. Based upon the concept of orderly spannin...
This is a preliminary study in which we use a genetic algorithm to solve the multiple layer floorpla...
The building blocks in a given floor-plan may have several possible physical implementations yie1din...
The first stage in hierarchical approaches to floorplan design determines certain topological relati...
[[abstract]]We consider in this paper the problem of slicing floorplan design with boundary-constrai...
Slicing tree has been an effective tool for VLSI floorplan de-sign. Floorplanners using slicing tree...
Abstract—Thermal issues are a primary concern in the three-dimensional (3D) integrated circuit (IC) ...
[[abstract]]In this paper, we will study floorplanning in 3-D integrated circuits (3D-ICs). Although...
Abstract — Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC)...
[[abstract]]In this paper, we will study fixed-outline floorplanning in 3D-IC. Although there is abu...
rently being developed to improve existing 2D designs by providing smaller chip areas and higher per...
A methodology of VLSI layout described by several authors first determines the relative positions of...
Dramatic improvements in circuit integration technologies have resulted in a huge increase in the co...
147 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2007.In Chapter 2, we present a fl...
129 p.Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 1987.In this thesis, a systematic ...
Floor-planning is a fundamental step in VLSI chip design. Based upon the concept of orderly spannin...