p e o m t

Hmicroelectronics. Free surface motion is in many interesting cases complex and influenced by a large number of parameters. The understanding of the underlying physics lends itself to many fun-damental investigations. In this context, the deposition of molten picoliter size solder droplets with diameter O ~100 mm! upon a flat conductive sub-strate is examined, thereby focusing on the effects of a tempera-ture dependence of surface tension ~temperature-induced Ma-rangoni effect! and viscosity. Earlier numerical and experimental investigations have shown that the impact velocity and surface tension are important param-eters determining the fluid mechanical behavior of the droplet upon impact within the parametric domain of solder jetting pro-cesses