For many years, CMOS process scaling has allowed a steady increase in the operating frequency and integration density of integrated circuits. Only recently, however, have we reached a point where it takes several clock cycles for global signals to traverse a complex digital system such as a modern microprocessor. Thus, interconnect latency must be taken into account in current and future design tools at the architectural as well as synthesis level. To this purpose, this work proposes a new latency-aware technique for the performance-driven concurrent insertion of flip-flops and repeaters in VLSI circuits. Overwhelming evidence showing an exponential increase in the number of pipelined interconnects with process scaling, for high-performance...
Signalling over long interconnect is a dominant issue in electronic chip design in current technolog...
Abstract- LGR (Logic Gates as Repeaters) – a methodology for delay optimization of CMOS logic circu...
It is widely accepted that, as semiconductor technology continues to evolve, interconnects have domi...
In this paper, we study the full-chp interconnect power model-ing.,We show that repeater,insertion i...
The size of future high-performance SoC is such that the time-of-flight of wires connecting distant ...
As process nodes continue to shrink to improve transistor density and performance, it is causing an ...
With growing chip sizes and operating frequencies, on-chip global interconnect has become a critical...
Abstract—Every new VLSI technology generation has resulted in interconnects increasingly limiting th...
Process variation and circuit aging in the nanometer regime result in remarkable, unneeded, and ambi...
The size of future high-performance SoC is such that the time-of-flight of wires connecting distant ...
With deeper and faster VLSI technologies, on-chip inductance has gained significance in the design o...
A System-on-a-Chip (SoC) has millions of transistors connected by wires or so called Interconnects. ...
Modern multicore systems have a large number of components operating in different clock domains and ...
Traditionally, hardware designs partitioned across multiple FPGAs have had low performance due to th...
Abstrnct-The propagation delay of interconnection lines is a major factor in determining the perform...
Signalling over long interconnect is a dominant issue in electronic chip design in current technolog...
Abstract- LGR (Logic Gates as Repeaters) – a methodology for delay optimization of CMOS logic circu...
It is widely accepted that, as semiconductor technology continues to evolve, interconnects have domi...
In this paper, we study the full-chp interconnect power model-ing.,We show that repeater,insertion i...
The size of future high-performance SoC is such that the time-of-flight of wires connecting distant ...
As process nodes continue to shrink to improve transistor density and performance, it is causing an ...
With growing chip sizes and operating frequencies, on-chip global interconnect has become a critical...
Abstract—Every new VLSI technology generation has resulted in interconnects increasingly limiting th...
Process variation and circuit aging in the nanometer regime result in remarkable, unneeded, and ambi...
The size of future high-performance SoC is such that the time-of-flight of wires connecting distant ...
With deeper and faster VLSI technologies, on-chip inductance has gained significance in the design o...
A System-on-a-Chip (SoC) has millions of transistors connected by wires or so called Interconnects. ...
Modern multicore systems have a large number of components operating in different clock domains and ...
Traditionally, hardware designs partitioned across multiple FPGAs have had low performance due to th...
Abstrnct-The propagation delay of interconnection lines is a major factor in determining the perform...
Signalling over long interconnect is a dominant issue in electronic chip design in current technolog...
Abstract- LGR (Logic Gates as Repeaters) – a methodology for delay optimization of CMOS logic circu...
It is widely accepted that, as semiconductor technology continues to evolve, interconnects have domi...