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creased microelectronic device densities and speeds. However, interconnection technology has not ad- imposes hybrid integration schemes with increased vanced proportionally. One of the main reasons is the limited availability of interconnection materials that are compatible with VLSI and electronic pack-aging technologies. The increased wire resistance as a result of smaller feature size, the residual wire capacitance resulting from fringing fields, the aspect ratio of the interconnection wires, and the interwire cross talk are among the main factors that prohibit more significant improvements in electrical intercon-nect performance. Consequently the overall perfor-mance of VLSI systems becomes increasingly dominated by the performance of long interconnects. For overcoming this limitation free-space optica