Add to ORKGCarbon fiducial marks are formed during thin film local delamination processes induced either by indentation, forming circular blisters, or by residual stress relief through telephone cord blister formations. Hydrocarbons are sucked into the crack tip during the delamination processes, outlining the crack tip opening angle (CTOA), which can be used to back calculate thin film adhesion using elastic or plastic analyses presented in the paper
Surfaces are more and more used to add specific properties to materials towards multifunctional sys...
While there are many stress relief mechanisms observed in thin films, excessive residual and externa...
There are many different stress relief mechanisms observed in thin films. One of the mechanisms invo...
Carbon fiducial marks are formed during thin film local delamination processes induced either by ind...
Carbon ®ducial marks are formed during thin-®lm local delamination processes induced either by super...
Thin film delamination can occur when the stored elastic energy per unit area in the film due to the...
Thin film adhesion can be measured by means of the nanoindentation technique [1]. In the case of a d...
Thin films, used in various applications and devices, must strongly adhere to their substrates. Due ...
AbstractIn this paper, a method to estimate fracture toughness, Γf, from the first indenter-induced ...
Indentation-induced delamination of thin films provides the basis for adhesion calculations. In the ...
A unique set of double-edge notched tension specimens of a Polyethylene Terephthalate Glycol-modi¿ed...
The mechanical integrity of thin films is characterized by the adhesion between solid bodies and mem...
Significant drops in adhesion have been measured for copper and diamond like carbon (DLC) films with...
AbstractInterfacial fracture (delamination) originating from channel or tunnel cracks is a common fa...
As the individual layers of interconnect structures decrease in size, it becomes increasingly diffic...
Surfaces are more and more used to add specific properties to materials towards multifunctional sys...
While there are many stress relief mechanisms observed in thin films, excessive residual and externa...
There are many different stress relief mechanisms observed in thin films. One of the mechanisms invo...
Carbon fiducial marks are formed during thin film local delamination processes induced either by ind...
Carbon ®ducial marks are formed during thin-®lm local delamination processes induced either by super...
Thin film delamination can occur when the stored elastic energy per unit area in the film due to the...
Thin film adhesion can be measured by means of the nanoindentation technique [1]. In the case of a d...
Thin films, used in various applications and devices, must strongly adhere to their substrates. Due ...
AbstractIn this paper, a method to estimate fracture toughness, Γf, from the first indenter-induced ...
Indentation-induced delamination of thin films provides the basis for adhesion calculations. In the ...
A unique set of double-edge notched tension specimens of a Polyethylene Terephthalate Glycol-modi¿ed...
The mechanical integrity of thin films is characterized by the adhesion between solid bodies and mem...
Significant drops in adhesion have been measured for copper and diamond like carbon (DLC) films with...
AbstractInterfacial fracture (delamination) originating from channel or tunnel cracks is a common fa...
As the individual layers of interconnect structures decrease in size, it becomes increasingly diffic...
Surfaces are more and more used to add specific properties to materials towards multifunctional sys...
While there are many stress relief mechanisms observed in thin films, excessive residual and externa...
There are many different stress relief mechanisms observed in thin films. One of the mechanisms invo...