Within the framework of project OPEFIC partly subsidized by the French ministry of research, the mechanisms of recrystallization in cold wire-drawn copper were finely studied in order to understand how the presence of very low content of impurities (sulphur in particular) can delay the recrystallization. After plastic deformation, the quantity of stored energy, mainly in dislocations form, is a parameter determining because it is the driving force of the static recrystallization process [1-4]. This stored energy is related to many parameters such as the material type, the deformation mode, temperature and level, the crystallographic orientation, the previous deformation crystallographic texture, etc
ABSTRACT The pure copper wires were wiredrawn at cryogenic and room temperatures. After deformation ...
When copper is deformed to high plastic strain (γ 3 4) at high strain rates (γ 104s-1 a mi...
The influence of stacking fault energy (SFE) on the mechanism of dynamic recrystallization (DRX) dur...
This study is concerned with the effect of particles, which are too small to produce Particle Stimul...
Wire drawing is a necessary operation for the production of small diameter electrical wires. During ...
It is well known that cold working of a crystalline solid leads to high concentrations of dislocatio...
Recovery, recrystallization and grain growth are among the most important metallurgical heat treatme...
The role of the stored energy in the process of static recrystallization is not well known. On the o...
The effect of plastic deformation upon the internal friction of various grades of copper has been in...
The presence of residual elements in the raw material slows down the recrystallization and changes t...
Oxygen free electronic copper, 99.995% purity, of two initial grain sizes, 50 {mu}m and 100 {mu}m, h...
Theory for describing the conditions leading to dynamic recrystallization in FCC metals is introduce...
The characteristics of dynamic recrystallization (DRX) during hot working of copper containing vario...
Several studies performed on metal polygonization [1-3] indicate that impurities lock the dislocatio...
RhumC: La classification des fils de cuivre "Tough Pitch selon le taux d'impuretks est en ...
ABSTRACT The pure copper wires were wiredrawn at cryogenic and room temperatures. After deformation ...
When copper is deformed to high plastic strain (γ 3 4) at high strain rates (γ 104s-1 a mi...
The influence of stacking fault energy (SFE) on the mechanism of dynamic recrystallization (DRX) dur...
This study is concerned with the effect of particles, which are too small to produce Particle Stimul...
Wire drawing is a necessary operation for the production of small diameter electrical wires. During ...
It is well known that cold working of a crystalline solid leads to high concentrations of dislocatio...
Recovery, recrystallization and grain growth are among the most important metallurgical heat treatme...
The role of the stored energy in the process of static recrystallization is not well known. On the o...
The effect of plastic deformation upon the internal friction of various grades of copper has been in...
The presence of residual elements in the raw material slows down the recrystallization and changes t...
Oxygen free electronic copper, 99.995% purity, of two initial grain sizes, 50 {mu}m and 100 {mu}m, h...
Theory for describing the conditions leading to dynamic recrystallization in FCC metals is introduce...
The characteristics of dynamic recrystallization (DRX) during hot working of copper containing vario...
Several studies performed on metal polygonization [1-3] indicate that impurities lock the dislocatio...
RhumC: La classification des fils de cuivre "Tough Pitch selon le taux d'impuretks est en ...
ABSTRACT The pure copper wires were wiredrawn at cryogenic and room temperatures. After deformation ...
When copper is deformed to high plastic strain (γ 3 4) at high strain rates (γ 104s-1 a mi...
The influence of stacking fault energy (SFE) on the mechanism of dynamic recrystallization (DRX) dur...