Most thermoforming product development processes rely on costly and time consuming forming trials to determine adequacy of the mold and process. In this paper, an analytical method is developed for shrinkage predictions on the basis of a visco-elastic constitutive material model with initial conditions from a commercial thermoforming simulation. The theoretical analysis and transfer functions have been developed to accommodate different sets of materials, process conditions, and mold geometry. The shrinkage model consists of a transient thermal analysis for temperature solution; a stretching phase analysis for inflation-induced stress estimation; a post contact analysis for thermal stress and relaxation; and a post-molding strain analysis b...
During the injection moulding process, the material is subjected to successive transformations, bei...
Injection molding is a manufacturing process for producing part for both thermoplastic and thermoset...
One of the most prominent failure modes in microelectronics devices is the delamination of epoxy mat...
Injection molded parts are susceptible to shrinkage effects which undermine the strict dimensional ...
ABSTRACT: One of the most challenging tasks in designing plastic parts, especially those that are fi...
Thesis (MTech (Mechanical Engineering))--Peninsula Technikon, 2003Injection moulding is a process by...
The challenge of lithographic production of electronic circuitry on polymer foil is that deformation...
A systematic study on the effect of processing conditions on mold shrinkage was undertaken for seven...
The phenomenon of shrinkage in injection molding is particularly relevant for the processing of semi...
The work reported herein is about an analysis on the quality (shrinkage) on a thick plate part using...
During the molding process residual stresses are formed due to thermal contraction during cooling as...
Summary This work presents a model to predict shrinkage and ejection forces for glass fiber reinforc...
The effects of cure shrinkages were investigated on the residual stresses, dimensional stability and...
A simple elastic model for residual stresses and shrinkage of a thin solidifying product is proposed...
The main cause of warpage in injection moldings is the imbalance of the thermal residual stresses th...
During the injection moulding process, the material is subjected to successive transformations, bei...
Injection molding is a manufacturing process for producing part for both thermoplastic and thermoset...
One of the most prominent failure modes in microelectronics devices is the delamination of epoxy mat...
Injection molded parts are susceptible to shrinkage effects which undermine the strict dimensional ...
ABSTRACT: One of the most challenging tasks in designing plastic parts, especially those that are fi...
Thesis (MTech (Mechanical Engineering))--Peninsula Technikon, 2003Injection moulding is a process by...
The challenge of lithographic production of electronic circuitry on polymer foil is that deformation...
A systematic study on the effect of processing conditions on mold shrinkage was undertaken for seven...
The phenomenon of shrinkage in injection molding is particularly relevant for the processing of semi...
The work reported herein is about an analysis on the quality (shrinkage) on a thick plate part using...
During the molding process residual stresses are formed due to thermal contraction during cooling as...
Summary This work presents a model to predict shrinkage and ejection forces for glass fiber reinforc...
The effects of cure shrinkages were investigated on the residual stresses, dimensional stability and...
A simple elastic model for residual stresses and shrinkage of a thin solidifying product is proposed...
The main cause of warpage in injection moldings is the imbalance of the thermal residual stresses th...
During the injection moulding process, the material is subjected to successive transformations, bei...
Injection molding is a manufacturing process for producing part for both thermoplastic and thermoset...
One of the most prominent failure modes in microelectronics devices is the delamination of epoxy mat...