The author published an application-specific tin whisker risk assessment algorithm in 2003, and issued an updated version in 2004. This algorithm is currently being used by a variety of high reliability manufacturers to manage the risks posed by tin whisker induced failures. Other similar methods have been developed elsewhere and are also being used. During the past year experimental data has become available on the performance of conformal coating for containing tin whiskers. Additionally, data and a model have been published concerning the distribution of tin whisker lengths. This paper outlines the incorporation of this new understanding into improved risk assessment methodologies. A model is presented that can be used to quantify the mi...
Tin whisker mitigation: research into mechanisms and strategies. Part 1, Effect of plating methodolo...
Tin, lead, and lead-tin solders are the most commonly used solders due to their low melting temperat...
Towards green technology application in electronic industry, pure tin as a Pb-free component lead fi...
Military and aerospace electronics manufacturers are forced to deal with components that are availab...
Integrators and designers of high-reliability systems exert little or no control over component-leve...
The objective of this ongoing study is to evaluate the ability of conformal coatings to mitigate the...
The purpose of this study was to develop and validate a new surface defect counting procedure to be ...
As a result of a global movement away from using lead (Pb) in electronic assemblies, component manuf...
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to...
Pure tin is currently the most widely employed lead-free finish for plating of component terminals d...
This report documents the plating requirements for the electrical and mechanical parts used in the T...
For years, the alloy of choice for electroplating electronic components has been tin-lead (Sn-Pb) al...
Pure electroplated tin is susceptible to the growth of fibrous whiskers that can produce short circu...
The objective of this ongoing study is to evaluate the ability of conformal coatings to mitigate the...
This paper presents the results of a research program set up to evaluate atomic layer deposition (AL...
Tin whisker mitigation: research into mechanisms and strategies. Part 1, Effect of plating methodolo...
Tin, lead, and lead-tin solders are the most commonly used solders due to their low melting temperat...
Towards green technology application in electronic industry, pure tin as a Pb-free component lead fi...
Military and aerospace electronics manufacturers are forced to deal with components that are availab...
Integrators and designers of high-reliability systems exert little or no control over component-leve...
The objective of this ongoing study is to evaluate the ability of conformal coatings to mitigate the...
The purpose of this study was to develop and validate a new surface defect counting procedure to be ...
As a result of a global movement away from using lead (Pb) in electronic assemblies, component manuf...
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to...
Pure tin is currently the most widely employed lead-free finish for plating of component terminals d...
This report documents the plating requirements for the electrical and mechanical parts used in the T...
For years, the alloy of choice for electroplating electronic components has been tin-lead (Sn-Pb) al...
Pure electroplated tin is susceptible to the growth of fibrous whiskers that can produce short circu...
The objective of this ongoing study is to evaluate the ability of conformal coatings to mitigate the...
This paper presents the results of a research program set up to evaluate atomic layer deposition (AL...
Tin whisker mitigation: research into mechanisms and strategies. Part 1, Effect of plating methodolo...
Tin, lead, and lead-tin solders are the most commonly used solders due to their low melting temperat...
Towards green technology application in electronic industry, pure tin as a Pb-free component lead fi...