We theoretically investigate the thermal boundary resistance and heat diffusion in AlGaN/GaN heterostructure field-effect transistors. Our calculations based on the diffuse mismatch model show that the thermal boundary resistance at the interface between GaN and SiC can strongly influence the temperature rise in the device channel
We present the mobility and diffusion constant in short GaN structures. Differential mobility decrea...
Integrating diamond with GaN high electron mobility transistors (HEMTs) improves thermal management,...
Heat dissipation plays a crucial role in the performance and reliability of high-power GaN-based ele...
The influence of a thermal boundary resistance (TBR) on temperature distribution in ungated AlGaN/Ga...
In this paper we evaluate heat diffusion in an AlGaN/GaN diode through a Monte Carlo simulator by e...
Wide-bandgap gallium nitride (GaN)-based semiconductors offer significant advantages over traditiona...
Benchmarking of thermal boundary resistance (TBR) of GaN-SiC interfaces for AlGaN/GaN HEMTs on SiC s...
Understanding the magnitude of the temperature in AlGaN/GaN heterostructure fi eld e ffect transisto...
Self-heating is one of the major issues of the existing gallium nitride (GaN) high electron mobility...
We presented an explicit empirical model of the thermal resistance of AlGaN/GaN high-electron-mobili...
In this paper, we present results from the simulations of a submicrometer AlGaN/GaN highelectron- m...
The performance of AlGaN-GaN high-electron mobility transistors (HEMTs) is influenced by the self-he...
The thermal impact of device bias-state and structures (such as source connected field plates, gate-...
International audienceIn this paper an analysis of thermal behavior of microwave power AlGaN/GaN HEM...
International audienceIn this paper an analysis of thermal behavior of microwave power AlGaN/GaN HEM...
We present the mobility and diffusion constant in short GaN structures. Differential mobility decrea...
Integrating diamond with GaN high electron mobility transistors (HEMTs) improves thermal management,...
Heat dissipation plays a crucial role in the performance and reliability of high-power GaN-based ele...
The influence of a thermal boundary resistance (TBR) on temperature distribution in ungated AlGaN/Ga...
In this paper we evaluate heat diffusion in an AlGaN/GaN diode through a Monte Carlo simulator by e...
Wide-bandgap gallium nitride (GaN)-based semiconductors offer significant advantages over traditiona...
Benchmarking of thermal boundary resistance (TBR) of GaN-SiC interfaces for AlGaN/GaN HEMTs on SiC s...
Understanding the magnitude of the temperature in AlGaN/GaN heterostructure fi eld e ffect transisto...
Self-heating is one of the major issues of the existing gallium nitride (GaN) high electron mobility...
We presented an explicit empirical model of the thermal resistance of AlGaN/GaN high-electron-mobili...
In this paper, we present results from the simulations of a submicrometer AlGaN/GaN highelectron- m...
The performance of AlGaN-GaN high-electron mobility transistors (HEMTs) is influenced by the self-he...
The thermal impact of device bias-state and structures (such as source connected field plates, gate-...
International audienceIn this paper an analysis of thermal behavior of microwave power AlGaN/GaN HEM...
International audienceIn this paper an analysis of thermal behavior of microwave power AlGaN/GaN HEM...
We present the mobility and diffusion constant in short GaN structures. Differential mobility decrea...
Integrating diamond with GaN high electron mobility transistors (HEMTs) improves thermal management,...
Heat dissipation plays a crucial role in the performance and reliability of high-power GaN-based ele...