eInstitute of Energy Technology,

able was the temperature of the substrate that was controlled in the range from 48°C to 135°C. The dynamics of molten solder microdroplet impact and solidification on the substrate was investigated using a flash microscopy technique. The time for the comple-tion of solidification from the moment of a solder droplet impact on the substrate varies between 150 ms and 350 ms. The dynamic interaction between the oscillation in the liquid region and the rapid advance of the solidification front was visualized, quantified, and presented in this paper. In a second series of experiments, the evolution of the wetting angle between the spreading drop and the substrate was recorded and analyzed. No quantitative agreement with Hoffman’s correlation for wetting was found. It was estab-lished that the wetting angle dynamics is strongly coupled with the evolution of the droplet free surface. Two successive regimes were distinguished during the spreading. The influence of the initial impact velocity and substrate temperature on the dynamics of the measured wetting angle was described in both regimes. To the best of our knowledge, this study presents the first published experimental results on the transient fluid dynamics and solidification of molten microdroplets impacting on a substrate at the above-mentioned time and length scales that are directly relevant to the novel solder jettin