Abstract. Statistical models are presented to describe the evolution of the surface roughness of polishing pads during the pad-conditioning process in chemical-mechanical polishing. The models describe the evolution of the surface-height probability-density function of solid pads during fixed height or fixed cut-rate conditioning. An integral equation is derived for the effect of conditioning on a foamed pad in terms of a model for a solid pad. The models that combine wear and conditioning are then discussed for both solid and foamed pads. Models include the dependence of the surface roughness on the shape and density of the cutting tips used in the conditioner and on other operating parameters. Good agreement is found between the model, Mo...
A mathematical model for chemical-mechanical polishing is developed. The effects of pad bending, flu...
This paper presents a theoretical and experimental investigation which attempts to provide a better ...
an im behav del d, and a er sub r CM impr 751 # A eived Conditioning schemes may be classified accor...
Statistical models are presented to describe the evolution of the surface roughness of polishing pad...
Fixed abrasive chemical–mechanical polishing (CMP) is an efficient surface finishing method. The non...
Fundamental investigation for pad conditioning was studied on CMP (Chemical Mechanical Polishing). I...
[[abstract]]In the chemical-mechanical polishing (CMP) process, the pad conditioning density distrib...
Fixed abrasive chemical mechanical polishing has some advantages in generating planarity surfaces of...
Surface polishing is a typical example of a machining process based on mixed chemical-mechanical phe...
[[abstract]]The primary consumables in chemical mechanical polishing (CMP) are the polishing pad and...
High precision optical components are required for modern life and future. To achieve component’s su...
The novel conditioner was developed for uniform conditioning across a pad. The conditioner is compos...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
A material removal rate (MRR) model as a function of abrasive weight concentration has been propose...
AbstractIn chemical-mechanical polishing (CMP), surface asperities of the polishing pad play a key r...
A mathematical model for chemical-mechanical polishing is developed. The effects of pad bending, flu...
This paper presents a theoretical and experimental investigation which attempts to provide a better ...
an im behav del d, and a er sub r CM impr 751 # A eived Conditioning schemes may be classified accor...
Statistical models are presented to describe the evolution of the surface roughness of polishing pad...
Fixed abrasive chemical–mechanical polishing (CMP) is an efficient surface finishing method. The non...
Fundamental investigation for pad conditioning was studied on CMP (Chemical Mechanical Polishing). I...
[[abstract]]In the chemical-mechanical polishing (CMP) process, the pad conditioning density distrib...
Fixed abrasive chemical mechanical polishing has some advantages in generating planarity surfaces of...
Surface polishing is a typical example of a machining process based on mixed chemical-mechanical phe...
[[abstract]]The primary consumables in chemical mechanical polishing (CMP) are the polishing pad and...
High precision optical components are required for modern life and future. To achieve component’s su...
The novel conditioner was developed for uniform conditioning across a pad. The conditioner is compos...
Due to copyright restrictions, the access to the full text of this article is only available via sub...
A material removal rate (MRR) model as a function of abrasive weight concentration has been propose...
AbstractIn chemical-mechanical polishing (CMP), surface asperities of the polishing pad play a key r...
A mathematical model for chemical-mechanical polishing is developed. The effects of pad bending, flu...
This paper presents a theoretical and experimental investigation which attempts to provide a better ...
an im behav del d, and a er sub r CM impr 751 # A eived Conditioning schemes may be classified accor...