Abstract-A single GaAs MMIC fabrication flow produces three different types of silicon nitride capacitors, with 50 nm, 200 nm, and 250 nm nominal dielectric thickness. Ramped voltage data indicates that all three types are reliable. The results are compared to predictions of the linear field and Frenkel-Poole conduction models for capacitor lifetime at fixed voltages
This paper focuses on zirconia and TiN based MIM buffer capacitors integrated in immediate vicinity ...
Monolithically integrated RC-snubbers were realized by metal-insulator-semiconductor capacitors on a...
Thin silicon nitride (Si3N4) films deposited using plasma-enhanced chemical deposition (PECVD) metho...
Silicon nitride thin film dielectrics are used in capacitive radio frequency micro-electromechanical...
We have studied the reliability of intrinsic SiN MIM capacitors designed for 48 V and 125 0C operati...
In this paper we report room temperature constant voltage life-time measurements of silicon nitride ...
Silicon nitride (SiN) metal-insulator-metal capacitors (MIMCAPs) are components of most GaAs and GaN...
We present ramped voltage data from a new nitride used in our fabrication process. Using the same fa...
Metal-insulator-metal capacitor (MIMC) reliability and electrical properties are defined by the TDDB...
Capacitor properties were studied using a special test mask. We derived improved measurement and tes...
In this paper, we propose for the first time an attractive Si3N4/laminated Al2O3-HfO2 (LAHO) stack m...
In this paper, we propose for the first time an attractive Si 3N4/laminated Al2O3-HfO2 (LAHO) stack ...
We report on the development of two silicon nitride films deposited at 300°C using PECVD processes f...
n this work, a novel, high quality, high-density, deposited at room temperature ultra thin 5 nm Si3N...
We have developed and characterized an ultra-thin 600 Å silicon nitride high-density MIM capacitor f...
This paper focuses on zirconia and TiN based MIM buffer capacitors integrated in immediate vicinity ...
Monolithically integrated RC-snubbers were realized by metal-insulator-semiconductor capacitors on a...
Thin silicon nitride (Si3N4) films deposited using plasma-enhanced chemical deposition (PECVD) metho...
Silicon nitride thin film dielectrics are used in capacitive radio frequency micro-electromechanical...
We have studied the reliability of intrinsic SiN MIM capacitors designed for 48 V and 125 0C operati...
In this paper we report room temperature constant voltage life-time measurements of silicon nitride ...
Silicon nitride (SiN) metal-insulator-metal capacitors (MIMCAPs) are components of most GaAs and GaN...
We present ramped voltage data from a new nitride used in our fabrication process. Using the same fa...
Metal-insulator-metal capacitor (MIMC) reliability and electrical properties are defined by the TDDB...
Capacitor properties were studied using a special test mask. We derived improved measurement and tes...
In this paper, we propose for the first time an attractive Si3N4/laminated Al2O3-HfO2 (LAHO) stack m...
In this paper, we propose for the first time an attractive Si 3N4/laminated Al2O3-HfO2 (LAHO) stack ...
We report on the development of two silicon nitride films deposited at 300°C using PECVD processes f...
n this work, a novel, high quality, high-density, deposited at room temperature ultra thin 5 nm Si3N...
We have developed and characterized an ultra-thin 600 Å silicon nitride high-density MIM capacitor f...
This paper focuses on zirconia and TiN based MIM buffer capacitors integrated in immediate vicinity ...
Monolithically integrated RC-snubbers were realized by metal-insulator-semiconductor capacitors on a...
Thin silicon nitride (Si3N4) films deposited using plasma-enhanced chemical deposition (PECVD) metho...