The objectives of this project are to investigate microstructure-mechanical-electronic transport property relationships of a new multifunctional material designated as ultrananocrystalline diamond (UNCD), and to utilize this material in microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS). Through interdisciplinary research and educational efforts of the team members from Northwestern University (NU), University of Illinois at Chicago (UIC) and University of Missouri-Columbia (UMC), in collaboration with Argonne and Sandia National Laboratories (ANL and SNL), an integrated experimental, analytical and computational program has evolved with the following approaches: 1. Scan probe microscopy approaches, including con...
Silicon is currently the most commonly used material for the fabrication of microelectromechanical s...
Ultrananocrystalline diamond (UNCD) is a 3–5 nm grain size material with many of the properties of d...
This thesis aims to provide the latest progresses on the experimental investigation of friction and ...
MEMS devices are currently fabricated primarily in silicon because of the available surface machinin...
n this work, we have synthesized ultra-nano-crystalline diamond (UNCD) thin films with average thic...
Diamond, because of its unique physical, chemical, and electrical properties and the feasibility of ...
This review focuses on describing the fundamental/applied materials science and technological applic...
Diamond is widely known for its extraordinary properties, such as high thermal conductivity, energy ...
Diamond is widely known for its extraordinary properties, such as high thermal conductivity, energy ...
Diamond, because of its unique physical, chemical, and electrical properties and the feasibility of ...
Tetragonal sp3-bonded diamond has the highest known atomic density. The nature of the bond and its h...
Carbon in its various forms, specifically nanocrystalline diamond, may become a key material for the...
Ultrananocrystalline diamond (UNCD) is one of the important members of the triad of nanostructured c...
Ultrananocrystalline diamond (UNCD) is a 3–5 nm grain size material with many of the properties of d...
Ultrananocrystalline diamond (UNCD) is a 3–5 nm grain size material with many of the properties of d...
Silicon is currently the most commonly used material for the fabrication of microelectromechanical s...
Ultrananocrystalline diamond (UNCD) is a 3–5 nm grain size material with many of the properties of d...
This thesis aims to provide the latest progresses on the experimental investigation of friction and ...
MEMS devices are currently fabricated primarily in silicon because of the available surface machinin...
n this work, we have synthesized ultra-nano-crystalline diamond (UNCD) thin films with average thic...
Diamond, because of its unique physical, chemical, and electrical properties and the feasibility of ...
This review focuses on describing the fundamental/applied materials science and technological applic...
Diamond is widely known for its extraordinary properties, such as high thermal conductivity, energy ...
Diamond is widely known for its extraordinary properties, such as high thermal conductivity, energy ...
Diamond, because of its unique physical, chemical, and electrical properties and the feasibility of ...
Tetragonal sp3-bonded diamond has the highest known atomic density. The nature of the bond and its h...
Carbon in its various forms, specifically nanocrystalline diamond, may become a key material for the...
Ultrananocrystalline diamond (UNCD) is one of the important members of the triad of nanostructured c...
Ultrananocrystalline diamond (UNCD) is a 3–5 nm grain size material with many of the properties of d...
Ultrananocrystalline diamond (UNCD) is a 3–5 nm grain size material with many of the properties of d...
Silicon is currently the most commonly used material for the fabrication of microelectromechanical s...
Ultrananocrystalline diamond (UNCD) is a 3–5 nm grain size material with many of the properties of d...
This thesis aims to provide the latest progresses on the experimental investigation of friction and ...