Abstract. Silicon oxide and hydrogen are ubiquitous in materials and processing issues in microelectronics. This paper reviews the value of infrared absorption spectroscopy to characterize the chemical and structural nature of silicon oxides, including buried oxides, and the presence of hydrogen both at silicon surfaces and in silicon oxides. Results involving the wet chemical cleaning of silicon and the fabrication issues of Silicon-on-Insulator are presented. Particular emphasis is given to the characterization of buried interfaces, for which IR spectroscopy is particularly useful. L'oxyde de silicium et l'hydrogbne jouent un role important dans la fabrication de matiriaux pour les composants microi16ctroniques. Cet article pris...
A single chamber system for plasma-enhanced chemical vapor deposition was employed to deposit differ...
Ultra-thin aluminum oxide (Al2O3 ) and hafnium oxide (HfO2) layers have been grown by atomic layer d...
Author Institution: Department of Chemical Engineering, Stanford UniversityAs microelectronic device...
Silicon oxide and hydrogen are ubiquitous in materials and processing issues in microelectronics. Th...
Chemical oxides formed on silicon surfaces by the wet cleaning agents [H2S04-H2O2 (SPM), HNO3, NH4OH...
The observation of transmission spectra in the infrared (2 to 16 μ) gives a sensitive and non-destru...
The n-Si(111)76 M KOH electrolyte interface has been investigated by in-situ multiple-internal refle...
An in situ method based on attenuated total reflection Fourier transform infrared spectroscopy (ATR-...
Infrared absorption spectra of impurities and radiation damage in silicon semiconductor
A high resolution infrared absorption study of silicon samples doped with sulphur by implantation an...
Changes in hydrogen environments in porous silicon prepared from a p-type silicon wafer with thermal...
We introduce a general scheme for calculating from first principles both the transverse-optical and ...
Fourier transform infrared spectroscopy and first principles calculations have been used to investig...
Interstitial oxygen profile across an epitaxial silicon and Czochralski silicon interface has been s...
The reaction of hydrogen-terminated Si(111) and oxide-terminated silicon surfaces with neat anhydrou...
A single chamber system for plasma-enhanced chemical vapor deposition was employed to deposit differ...
Ultra-thin aluminum oxide (Al2O3 ) and hafnium oxide (HfO2) layers have been grown by atomic layer d...
Author Institution: Department of Chemical Engineering, Stanford UniversityAs microelectronic device...
Silicon oxide and hydrogen are ubiquitous in materials and processing issues in microelectronics. Th...
Chemical oxides formed on silicon surfaces by the wet cleaning agents [H2S04-H2O2 (SPM), HNO3, NH4OH...
The observation of transmission spectra in the infrared (2 to 16 μ) gives a sensitive and non-destru...
The n-Si(111)76 M KOH electrolyte interface has been investigated by in-situ multiple-internal refle...
An in situ method based on attenuated total reflection Fourier transform infrared spectroscopy (ATR-...
Infrared absorption spectra of impurities and radiation damage in silicon semiconductor
A high resolution infrared absorption study of silicon samples doped with sulphur by implantation an...
Changes in hydrogen environments in porous silicon prepared from a p-type silicon wafer with thermal...
We introduce a general scheme for calculating from first principles both the transverse-optical and ...
Fourier transform infrared spectroscopy and first principles calculations have been used to investig...
Interstitial oxygen profile across an epitaxial silicon and Czochralski silicon interface has been s...
The reaction of hydrogen-terminated Si(111) and oxide-terminated silicon surfaces with neat anhydrou...
A single chamber system for plasma-enhanced chemical vapor deposition was employed to deposit differ...
Ultra-thin aluminum oxide (Al2O3 ) and hafnium oxide (HfO2) layers have been grown by atomic layer d...
Author Institution: Department of Chemical Engineering, Stanford UniversityAs microelectronic device...