We have developed fast IC process simulation technique based on an empirical resist and etch models to compute the silicon image of designs as large as a full ULSI chip. The simulated silicon image is used to verify the correct electrical operation of the chip and its compliance to semiconductor manufacturing rules. This significantly reduces the manufacturing and development turn-around-time (TAT) by decreasing the number of costly and time-consuming manufacturing test cycles. The basis of these techniques is a fast edge-based optical and process simulator. An edge-movement algorithm is used to compute the displacements of edge fragments in the original design, yielding an approximation to the silicon image. In this paper we will demonstra...
In contrast to the early times of simulation where the tools were dedicated either to the simulation...
This report describes the activity carried out to characterize, by means of a process simulator, a...
During fabrication process, mixed analog and digital integrated circuits (ICs) are more susceptible ...
TSV (Through silicon via) is the new generation of packaging technology in integrated circuits indus...
TSV (Through silicon via) is the new generation of packaging technology in integrated circuits indus...
This paper presents a new 3D simulator, an extended version of our previous developed 2D simulator [...
Process simulation has shown to be an important tool for the development in the fields of ULSI and p...
In VLSI development process simulation is needed to understand the interaction between successive pr...
Today’s design flows sign-off performance and power prior to application of resolution enhancement t...
TSV (Through Silicon Via) has been widely welcomed as an enabling technology for three-dimensional i...
The purpose of this research is to develop a cost effective timing simulator for digital metal-oxide...
This paper presents a new 2-D simulator, which can simulate etching, deposition and arbitrary sequen...
A new two-dimensional multilayer process simulator based on finite element method has been developed...
This paper presents a new 2-D simulator, which can simulate etching, deposition and arbitrary sequen...
The increasing need for functionality and portability in consumer electronics is pushing the microel...
In contrast to the early times of simulation where the tools were dedicated either to the simulation...
This report describes the activity carried out to characterize, by means of a process simulator, a...
During fabrication process, mixed analog and digital integrated circuits (ICs) are more susceptible ...
TSV (Through silicon via) is the new generation of packaging technology in integrated circuits indus...
TSV (Through silicon via) is the new generation of packaging technology in integrated circuits indus...
This paper presents a new 3D simulator, an extended version of our previous developed 2D simulator [...
Process simulation has shown to be an important tool for the development in the fields of ULSI and p...
In VLSI development process simulation is needed to understand the interaction between successive pr...
Today’s design flows sign-off performance and power prior to application of resolution enhancement t...
TSV (Through Silicon Via) has been widely welcomed as an enabling technology for three-dimensional i...
The purpose of this research is to develop a cost effective timing simulator for digital metal-oxide...
This paper presents a new 2-D simulator, which can simulate etching, deposition and arbitrary sequen...
A new two-dimensional multilayer process simulator based on finite element method has been developed...
This paper presents a new 2-D simulator, which can simulate etching, deposition and arbitrary sequen...
The increasing need for functionality and portability in consumer electronics is pushing the microel...
In contrast to the early times of simulation where the tools were dedicated either to the simulation...
This report describes the activity carried out to characterize, by means of a process simulator, a...
During fabrication process, mixed analog and digital integrated circuits (ICs) are more susceptible ...