Recently Ge is extensively investigated as an alternative material to Si because of its higher mobility and injection velocity [1]. A lot of work is done concerning gate stack to develop practical Ge MOS devices and 100-nm-scale MOS devices [2,3] were already reported. However, activities of investigation on doping and shallow junction formation are limited compared with them. Although th
Ultra shallow junction fabrication in large scaled integrated (ULSI) technology is one of the diffic...
Incorporation of pseudomorphic SiGe layers into Si CMOS has prospects of improving the hole channel ...
Defects produced by ion implantation in Si and Ge, their evolution upon post-implantation annealing,...
In this paper the impact of Ge-implantation on the work function of fully silicided NiSi gate is inv...
[[abstract]]The reduction of transient enhanced diffusion (TED) and suppression of short-channel eff...
How to realize the ultra-shallow junction is an important challenge when the feature size of the MOS...
As device sizes continue to shrink, increasing the dopant activation even beyond solid solubility wh...
The quest for higher performance of scaled down technologies resulted in the use of high-mobility su...
The trend for decreasing geometries within CMOS architecture is driving the need for ever shallower,...
Power dissipation has become one of the most significant impediments to continued scaling of complem...
Incorporation of pseudomorphic SiGe layers into Si CMOS has prospects of improving the hole channel ...
This paper presents an advanced shallow junction formation method which is applicable to fabricate s...
4.00SIGLEAvailable from British Library Document Supply Centre- DSC:9091.9F(AERE-R--12117) / BLDSC -...
The performance of strained silicon (Si) as the channel material for today’s metal-oxide-semiconduct...
In this paper the impact of Ge-implantation on the work function of fully suicided NiSi gate is inve...
Ultra shallow junction fabrication in large scaled integrated (ULSI) technology is one of the diffic...
Incorporation of pseudomorphic SiGe layers into Si CMOS has prospects of improving the hole channel ...
Defects produced by ion implantation in Si and Ge, their evolution upon post-implantation annealing,...
In this paper the impact of Ge-implantation on the work function of fully silicided NiSi gate is inv...
[[abstract]]The reduction of transient enhanced diffusion (TED) and suppression of short-channel eff...
How to realize the ultra-shallow junction is an important challenge when the feature size of the MOS...
As device sizes continue to shrink, increasing the dopant activation even beyond solid solubility wh...
The quest for higher performance of scaled down technologies resulted in the use of high-mobility su...
The trend for decreasing geometries within CMOS architecture is driving the need for ever shallower,...
Power dissipation has become one of the most significant impediments to continued scaling of complem...
Incorporation of pseudomorphic SiGe layers into Si CMOS has prospects of improving the hole channel ...
This paper presents an advanced shallow junction formation method which is applicable to fabricate s...
4.00SIGLEAvailable from British Library Document Supply Centre- DSC:9091.9F(AERE-R--12117) / BLDSC -...
The performance of strained silicon (Si) as the channel material for today’s metal-oxide-semiconduct...
In this paper the impact of Ge-implantation on the work function of fully suicided NiSi gate is inve...
Ultra shallow junction fabrication in large scaled integrated (ULSI) technology is one of the diffic...
Incorporation of pseudomorphic SiGe layers into Si CMOS has prospects of improving the hole channel ...
Defects produced by ion implantation in Si and Ge, their evolution upon post-implantation annealing,...