Add to ORKGPerfluorocarbons (PFCs) such as CF4 and cyclic (c-) C4F8, which have been used in the dry etching of SiO2, have big global warming potentials and very long lifetimes as shown in Table 1 [1]. Recently the PFC alternative gase
In the semiconductor industry, fluorocarbon (FC) plasma is widely used in SiO2 etching, with Ar typi...
In standard production technology of crystalline silicon solar cells most of the etching steps are c...
A mass spectrometric analysis of the neutral products and the positive ions extracted from discharge...
Perfluorocarbons (PFCs) such as CF4 and cyclic (c-) C4F8, which have been used in the dry etching of...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
International audienceIn this paper, we analyse, by the use of different plasma diagnostics, appeara...
Plasma etch is one of the most widely used processes in the semiconductor industry. It is used both ...
Perfluorocompounds commonly used by the microelectronics industry are considered potent global warmi...
Four different F{sub 2}-based gases (SF{sub 6}, NF{sub 3}, PF{sub 5}, and BF{sub 3}) were examined f...
As part of a project with SEMATECH, detailed chemical reaction mechanisms have been developed that d...
The use of NF3 is significantly increasing every year. However, NF3 is a greenhouse gas with a very ...
Reactive ion etch processes for modern interlevel dielectrics become more and more complex, especial...
Fluorocarbon plasmas are used for selective etching of silicon oxide in microelectronics and more re...
Plasma etching, the selective removal of materials by reaction with chemically active species formed...
Advanced semiconductor manufacturing requires precise plasma etching control for patterning complex ...
In the semiconductor industry, fluorocarbon (FC) plasma is widely used in SiO2 etching, with Ar typi...
In standard production technology of crystalline silicon solar cells most of the etching steps are c...
A mass spectrometric analysis of the neutral products and the positive ions extracted from discharge...
Perfluorocarbons (PFCs) such as CF4 and cyclic (c-) C4F8, which have been used in the dry etching of...
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer...
International audienceIn this paper, we analyse, by the use of different plasma diagnostics, appeara...
Plasma etch is one of the most widely used processes in the semiconductor industry. It is used both ...
Perfluorocompounds commonly used by the microelectronics industry are considered potent global warmi...
Four different F{sub 2}-based gases (SF{sub 6}, NF{sub 3}, PF{sub 5}, and BF{sub 3}) were examined f...
As part of a project with SEMATECH, detailed chemical reaction mechanisms have been developed that d...
The use of NF3 is significantly increasing every year. However, NF3 is a greenhouse gas with a very ...
Reactive ion etch processes for modern interlevel dielectrics become more and more complex, especial...
Fluorocarbon plasmas are used for selective etching of silicon oxide in microelectronics and more re...
Plasma etching, the selective removal of materials by reaction with chemically active species formed...
Advanced semiconductor manufacturing requires precise plasma etching control for patterning complex ...
In the semiconductor industry, fluorocarbon (FC) plasma is widely used in SiO2 etching, with Ar typi...
In standard production technology of crystalline silicon solar cells most of the etching steps are c...
A mass spectrometric analysis of the neutral products and the positive ions extracted from discharge...