Design and Optimization of On-Chip Interconnects Using Wave-Pipelined Multiplexed Routing," TVLSI 9(15

Abstract—Every new VLSI technology generation has resulted in interconnects increasingly limiting the performance, area, and power dissipation of new processors. Subsequently, it is necessary to devise efficient interconnect design techniques to reduce the im-pact of VLSI interconnects on overall system design. New optimiza-tions of a wave-pipelined multiplexed (WPM) interconnect routing circuit are described in this paper. These WPM circuits can be used with current interconnect repeater circuits to further reduce in-terconnect delay, interconnect area, transistor area, and/or power dissipation. For example, new area constrained WPM circuit opti-mizations illustrate that the interconnect circuit power can be re-duced by 26 % or the interconnect performance can be improved by 74%. Moreover, in both these cases, because a significant number of repeaters are eliminated, the transistor area can reduce by 41% or 29%, respectively. Finally, the tolerance of WPM circuits to crosstalk noise, power supply noise, clock skew, and manufacturing variations is also presented. This study of tolerance levels defines the conditions under which the WPM circuit will function cor-rectly, and it is shown in this paper for the first time that WPM circuits are robust enough to operate with variability that can be encountered in deep submicrometer technologies. Index Terms—Low-power high-performance design, on-chip in-terconnects, on-chip networks, time-division multiplexing (TDM), wave-pipelined multiplexing (WPM). I