A Chemical and Thermal Resistant Wafer Bonding Adhesive Simplifying Wafer Backside Processing

etching, adhesive A variety of adhesives have been demonstrated for use in thinning and backside processing of III-V substrates.1-4 Each process exhibits certain limitations based on the adhesive’s chemical or thermal resistance. As a result, an adhesive’s property limitation may drive up costs or reduce throughput by necessitating the use of additional protective aids or special tooling. A new product developed by Brewer Science, Inc. (BSI), WaferBOND™5 adhesive, eliminates the need for such aids by directly simplifying the process. WaferBOND™ adhesive exhibits an unusually high resistance to process conditions, which enables the use of strong acids and bases, stripping solvents, and temperatures in excess of 200ºC. Applied with conventional spin-on equipment, the material coats with exceptional uniformity (<0.3 % TTV), cures and bonds at relatively low temperatures, and demounts in corrosion-safe chemistries in times that are substantially lower than the competition, which allow an increase in throughput. This paper discusses the benefits of the WaferBOND™ adhesive mounting product and the ease of integrating it into an existing process line