DEVELOPMENT OF SCANNING MEMS MIRROR WITH NEW ASSEMBLY STRUCTURE

This paper introduces the development of a new MEMS-based optical mirror, which performs optical scanning function with discrete reflection angles in an out-of-plane configuration. The device was fabricated through Deep Reactive Ion Etching (DRIE) process on silicon-on-insulator (SOI) wafer, followed by assembly with two metalised glass dies. The optical mirrors can be tilted by electrostatic forces between the opposite electrodes on the SOI and glass dies. The most outstanding performance that can be expected from the device is the discrete and therefore, reliable tilting angle of the mirror, which is guaranteed by its unique mechanical structure and the electrostatic-driven mechanism. In this paper, the working principle of the new MEMS mirror was presented, followed by the introduction of device design, mechanical simulation, microfabrication process, assembly solution, and some testing results. The potential application of this new MEMS mirror is for light beam scanning or optical sensing (detection)