EUDET-Memo-2008-20 Integrated pixel readout for a TPC at NIKHEF

We report on present R&D activities at NIKHEF for the fabrication of a pixel readout TPC for the future International Linear Collider. Latest NIKHEF activities involve the fabrication and testing of integrated Micromegas structures (InGrid) on top of Timepix chips. A beam test at the PS/T9 at CERN has been performed succesfuly. Other new structures as well (GEMgrid and Twingrid) are under study. The protection of the Timepix chips against discharges by means of high resistive materials has been successfully applied using silicon rich nitride (SiRN) in Ar and He based gas mixtures