A NOVEL WET PROCESSING TECHNOLOGY

We have evaluated the hydrodynamics of current wet processing techniques for high density pattern etching. The diffusion layer proved to be the main obstacle for a controlled manufacturing of patterns smaller than 100 microns. The result is a limited line resolution and acuity with unacceptably low yields. By utilizing mechanical action at the interface, a novel technology accelerates the transport of matter. Moreover, it was shown that by controlling the mechanical activity one can achieve uniform processing conditions across the entire area of the substrate. Elements of this novel technique are discussed and several results of its application in various patterns and copper laminates are shown. The controlling factor, the transport of matter at the interface Conventional wisdom in interconnects fabrication utilizes the same liquid to achieve two objectives: the chemical activity and the transport of matter. The first objective is to provide the chemicals needed in the process. For instance, a solution of Cupric Chloride is utilized to etch metallic copper away from the imaged copper laminate. It is the chemical activity of this solution that makes the etching process possible. The second objective is to provide the exchange of matter at the reacting interface. For this activit