To achieve minimum signal propagation delay, the non-uniform wire width routing architecture has been widely used in modern VLSI design. The non-uniform routing architecture exploits the wire width exibilities to trade area for performance. However, many additional design rules, which conne the routing exibilities, are introduced in nanoscale circuit designs. With the increasing difculties of fabricating nanoscale circuits, the conventional non-uniform routing architecture becomes clumsy. We propose an uniform dual-rail routing architecture to cope with these new challenges. The proposed architecture exploits the anti-Miller effect between two adjacent wires with the same signal source. Hence, the coupling capacitance between these two wire...
In VLSI physical design, the routing task consists of using over-the-cell metal wires to connect pin...
The inter-wire spacing in a VLSI chip becomes closer as the VLSI fabrication technology rapidly evol...
In this paper, we study the interconnect layout optimization problem under a higher-order RLC model ...
Abstract | Deep sub-micron e ects, along with increasing interconnect densities, have increased the ...
This paper focused on routing in VLSI nanometre era to show that the proposed approach has better pr...
Circuit interconnect has become a substantial obstacle in the design of high performance systems..4 ...
With exponentially increasing integration densities and shrinking characteristic geometries on a chi...
Abstract:- In recent years, scaling down device dimension or utilizing novel crystallization technol...
With the exponential reduction in the scaling of feature size, inter-wire coupling capacitance becom...
Thesis: S.M., Massachusetts Institute of Technology, Sloan School of Management, Operations Research...
Abstract — This article describes an algorithm for curvilinear detailed routing. We significantly im...
As technology advances, the effect of intra-module delays become less significant, while the effect ...
As we increasingly use advanced technology nodes to design integrated circuits (ICs), physical desig...
Abstract- With the exponential reduction in scaling of feature size, inter-wire coupling capacitance...
The routing architecture of an FPGA consists of the length of the wires, the type of switch used to ...
In VLSI physical design, the routing task consists of using over-the-cell metal wires to connect pin...
The inter-wire spacing in a VLSI chip becomes closer as the VLSI fabrication technology rapidly evol...
In this paper, we study the interconnect layout optimization problem under a higher-order RLC model ...
Abstract | Deep sub-micron e ects, along with increasing interconnect densities, have increased the ...
This paper focused on routing in VLSI nanometre era to show that the proposed approach has better pr...
Circuit interconnect has become a substantial obstacle in the design of high performance systems..4 ...
With exponentially increasing integration densities and shrinking characteristic geometries on a chi...
Abstract:- In recent years, scaling down device dimension or utilizing novel crystallization technol...
With the exponential reduction in the scaling of feature size, inter-wire coupling capacitance becom...
Thesis: S.M., Massachusetts Institute of Technology, Sloan School of Management, Operations Research...
Abstract — This article describes an algorithm for curvilinear detailed routing. We significantly im...
As technology advances, the effect of intra-module delays become less significant, while the effect ...
As we increasingly use advanced technology nodes to design integrated circuits (ICs), physical desig...
Abstract- With the exponential reduction in scaling of feature size, inter-wire coupling capacitance...
The routing architecture of an FPGA consists of the length of the wires, the type of switch used to ...
In VLSI physical design, the routing task consists of using over-the-cell metal wires to connect pin...
The inter-wire spacing in a VLSI chip becomes closer as the VLSI fabrication technology rapidly evol...
In this paper, we study the interconnect layout optimization problem under a higher-order RLC model ...