Integrators and designers of high-reliability systems exert little or no control over component-level plating processes that affect the propensity for tin whiskering. Challenges of how to assure long-term reliability, while continuing to use COTS parts plated with pure tin, continue to arise. An integrated, quantitative, standardized methodology is proposed whereby mitigation levels can be selected that are appropriate for specific applications of pure tin for given end-uses. A system of hardware end-use classification is proposed, together with recommended appropriate risk mitigation approaches. An updated version of the application-specific risk assessment algorithm is presented together with recommended thresholds for acceptability withi...
The kinetics of whisker growth on pure, electroplated tin layers is known since many years and commo...
Electroplated tin finishes are widely utilised in the electronics industry due to their advantageous...
Tin whisker mitigation: research into mechanisms and strategies. Part 2, Post-plating mitigation met...
The author published an application-specific tin whisker risk assessment algorithm in 2003, and issu...
Pure tin is currently the most widely employed lead-free finish for plating of component terminals d...
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to...
As a result of a global movement away from using lead (Pb) in electronic assemblies, component manuf...
This report documents the plating requirements for the electrical and mechanical parts used in the T...
The purpose of this study was to develop and validate a new surface defect counting procedure to be ...
For years, the alloy of choice for electroplating electronic components has been tin-lead (Sn-Pb) al...
Pure electroplated tin is susceptible to the growth of fibrous whiskers that can produce short circu...
As a result of the global transition to lead (Pb)-free electronics, pure tin and high tin lead-free ...
This paper presents the results of a research program set up to evaluate atomic layer deposition (AL...
Tin whisker mitigation: research into mechanisms and strategies. Part 1, Effect of plating methodolo...
The objective of this ongoing study is to evaluate the ability of conformal coatings to mitigate the...
The kinetics of whisker growth on pure, electroplated tin layers is known since many years and commo...
Electroplated tin finishes are widely utilised in the electronics industry due to their advantageous...
Tin whisker mitigation: research into mechanisms and strategies. Part 2, Post-plating mitigation met...
The author published an application-specific tin whisker risk assessment algorithm in 2003, and issu...
Pure tin is currently the most widely employed lead-free finish for plating of component terminals d...
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to...
As a result of a global movement away from using lead (Pb) in electronic assemblies, component manuf...
This report documents the plating requirements for the electrical and mechanical parts used in the T...
The purpose of this study was to develop and validate a new surface defect counting procedure to be ...
For years, the alloy of choice for electroplating electronic components has been tin-lead (Sn-Pb) al...
Pure electroplated tin is susceptible to the growth of fibrous whiskers that can produce short circu...
As a result of the global transition to lead (Pb)-free electronics, pure tin and high tin lead-free ...
This paper presents the results of a research program set up to evaluate atomic layer deposition (AL...
Tin whisker mitigation: research into mechanisms and strategies. Part 1, Effect of plating methodolo...
The objective of this ongoing study is to evaluate the ability of conformal coatings to mitigate the...
The kinetics of whisker growth on pure, electroplated tin layers is known since many years and commo...
Electroplated tin finishes are widely utilised in the electronics industry due to their advantageous...
Tin whisker mitigation: research into mechanisms and strategies. Part 2, Post-plating mitigation met...