Add to ORKGIn recent decades, the electronic industry has shown a clear trend towards miniaturization with increasing functionality. In the context of essential competition within the market, the reliability of long term operations has become a popular issue. This study examines the properties of printed circuit board (PCB) and its failure phenomena. PCB reliability i
An independent study has been carried out to assess the extent to which the physics-of-failure (PoF)...
A methodology for evaluating suitable alternative materials to traditional tin-lead solder, as an el...
This paper investigates the material, process and design influences on the reliability of BGA solder...
This paper describes modeling technology and its use in providing data governing the assembly and su...
In this paper, the reliability prediction of a power electronics building block (PEBB) printed circu...
This two day workshop will discuss a range of topics, including root cause analysis, physics-of-fail...
Background. Printed circuit boards of modern analog, digital and digital-analog electronic devices o...
A printed circuit board (PCB) is an essential element for practical circuit applications and its fai...
The New England Lead Free Consortium, composed of many companies in the electronic supply chain in t...
The technology trends of Microelectronics and Microsystems are mainly characterized by miniaturizati...
This paper presents a method to predict the reliability of electronic components subjected to intens...
In this project, two different solder bump materials are evaluated, they are lead-based 63Sn/37Pb so...
While the electronics industry continues to strive towards miniaturization, it is important to under...
Reliability quantification is one of the most important tasks in Reliability Engineering. During the...
Abundant data exist on the short-term reliability (i.e. less than 5 years) of lead-free solder joint...
An independent study has been carried out to assess the extent to which the physics-of-failure (PoF)...
A methodology for evaluating suitable alternative materials to traditional tin-lead solder, as an el...
This paper investigates the material, process and design influences on the reliability of BGA solder...
This paper describes modeling technology and its use in providing data governing the assembly and su...
In this paper, the reliability prediction of a power electronics building block (PEBB) printed circu...
This two day workshop will discuss a range of topics, including root cause analysis, physics-of-fail...
Background. Printed circuit boards of modern analog, digital and digital-analog electronic devices o...
A printed circuit board (PCB) is an essential element for practical circuit applications and its fai...
The New England Lead Free Consortium, composed of many companies in the electronic supply chain in t...
The technology trends of Microelectronics and Microsystems are mainly characterized by miniaturizati...
This paper presents a method to predict the reliability of electronic components subjected to intens...
In this project, two different solder bump materials are evaluated, they are lead-based 63Sn/37Pb so...
While the electronics industry continues to strive towards miniaturization, it is important to under...
Reliability quantification is one of the most important tasks in Reliability Engineering. During the...
Abundant data exist on the short-term reliability (i.e. less than 5 years) of lead-free solder joint...
An independent study has been carried out to assess the extent to which the physics-of-failure (PoF)...
A methodology for evaluating suitable alternative materials to traditional tin-lead solder, as an el...
This paper investigates the material, process and design influences on the reliability of BGA solder...