Preventing thermal hot spots and large temperature variations on the die is critical for addressing the challenges in system reliabil-ity, performance, cooling cost and leakage power. Reactive thermal management methods, which take action after temperature reaches a given threshold, maintain the temperature below a critical level at the cost of performance, and do not address the temperature vari-ations. In this work, we propose a proactive thermal management approach, which estimates the future temperature using regression, and allocates workload on a multicore system to reduce and balance the temperature to avoid temperature induced problems. Our tech-nique reduces the hot spots and temperature variations signicantly in comparison to reac...
Current multicore platforms contain different types of cores, organized in clusters (e.g., ARM's big...
Many embedded heterogeneous MPSoCs integrate general purpose cores along with special purpose cores....
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors tha...
Abstract — Designing thermal management strategies that reduce the impact of hot spots and on-die te...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
Constant increase in performance demands, more aggressive technology scaling and higher transistor i...
Conventional thermal management techniques are reactive in nature; that is, they take action after t...
Abstract — Thermal balancing and reducing hot-spots are two important challenges facing the MPSoC de...
(MPSoCs) are more complex from a thermal perspective com-pared to the homogeneous MPSoCs because of ...
In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, tim...
The goal of thermal management is to meet maximum operating temperature constraints, while at the sa...
none4The goal of thermal management is to meet maximum operating temperature constraints, while at t...
Abstract—Multi-core System-on-Chip (SoC) has become a popular execution platform for many embedded r...
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors tha...
Current multicore platforms contain different types of cores, organized in clusters (e.g., ARM's big...
Current multicore platforms contain different types of cores, organized in clusters (e.g., ARM's big...
Many embedded heterogeneous MPSoCs integrate general purpose cores along with special purpose cores....
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors tha...
Abstract — Designing thermal management strategies that reduce the impact of hot spots and on-die te...
High temperatures and large thermal variations on the die create severe challenges in system reliabi...
Constant increase in performance demands, more aggressive technology scaling and higher transistor i...
Conventional thermal management techniques are reactive in nature; that is, they take action after t...
Abstract — Thermal balancing and reducing hot-spots are two important challenges facing the MPSoC de...
(MPSoCs) are more complex from a thermal perspective com-pared to the homogeneous MPSoCs because of ...
In deep submicron circuits, elevation in temperatures has brought new challenges in reliability, tim...
The goal of thermal management is to meet maximum operating temperature constraints, while at the sa...
none4The goal of thermal management is to meet maximum operating temperature constraints, while at t...
Abstract—Multi-core System-on-Chip (SoC) has become a popular execution platform for many embedded r...
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors tha...
Current multicore platforms contain different types of cores, organized in clusters (e.g., ARM's big...
Current multicore platforms contain different types of cores, organized in clusters (e.g., ARM's big...
Many embedded heterogeneous MPSoCs integrate general purpose cores along with special purpose cores....
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors tha...