High Energy Physics continues to push the technical boundaries for electronics. There is no area where this is truer than for vertex detectors. Lower mass and power along with higher resolution and radiation tolerance are driving forces. New technologies such as SOI CMOS detectors and three dimensional (3D) integrated circuits offer new opportunities to meet these challenges. The fundamentals for SOI CMOS detectors and 3D integrated circuits are discussed. Examples of each approach for physics applications are presented. Cost issues and ways to reduce development costs are discussed
Vertex detectors for the next LHC experiments upgrades will need to have low mass while at the same ...
High energy physics experiments at future particle accelerators set very demanding requirements on t...
Hybrid pixels detectors featuring high spatial resolution, very good signal to noise ratio and radia...
High Energy Physics continues to push the technical boundaries for electronics. There is no area whe...
3D-Integrated Circuit technology enables higher densities of electronic circuitry per unit area with...
Three dimensional integrated circuits are well suited to improving circuit bandwidth and increasing ...
AbstractMicro-systems based on the Micro Electro Mechanical Systems (MEMS) technology have been used...
Micro-systems based on the Micro Electro Mechanical Systems (MEMS) technology have been used in mini...
Several challenges for tracking with semiconductor detectors in the high rate environment of future ...
Three dimensional integrated circuits are well suited to improving circuit bandwidth and increasing ...
There is no question that 3D integrated circuit design will play an important role in the continuing...
Various fabrications routes to create '3D' detectors have been investigated and the electrical chara...
AbstractThe potential of 3D integration of sensors and readout electronics is being explored in view...
Microelectronics has become a key enabling technology in the development of tracking detectors for H...
This paper addresses three topics: First, a new three-dimensional CMOS-SOI on SOI technology is pres...
Vertex detectors for the next LHC experiments upgrades will need to have low mass while at the same ...
High energy physics experiments at future particle accelerators set very demanding requirements on t...
Hybrid pixels detectors featuring high spatial resolution, very good signal to noise ratio and radia...
High Energy Physics continues to push the technical boundaries for electronics. There is no area whe...
3D-Integrated Circuit technology enables higher densities of electronic circuitry per unit area with...
Three dimensional integrated circuits are well suited to improving circuit bandwidth and increasing ...
AbstractMicro-systems based on the Micro Electro Mechanical Systems (MEMS) technology have been used...
Micro-systems based on the Micro Electro Mechanical Systems (MEMS) technology have been used in mini...
Several challenges for tracking with semiconductor detectors in the high rate environment of future ...
Three dimensional integrated circuits are well suited to improving circuit bandwidth and increasing ...
There is no question that 3D integrated circuit design will play an important role in the continuing...
Various fabrications routes to create '3D' detectors have been investigated and the electrical chara...
AbstractThe potential of 3D integration of sensors and readout electronics is being explored in view...
Microelectronics has become a key enabling technology in the development of tracking detectors for H...
This paper addresses three topics: First, a new three-dimensional CMOS-SOI on SOI technology is pres...
Vertex detectors for the next LHC experiments upgrades will need to have low mass while at the same ...
High energy physics experiments at future particle accelerators set very demanding requirements on t...
Hybrid pixels detectors featuring high spatial resolution, very good signal to noise ratio and radia...