Abstract—This paper presents guidelines for the deep reactive ion etching (DRIE) of silicon MEMS structures, employin
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
This bachelor thesis deals with optimization of cryogenic and Bosch deep reactive ion etching (DRIE)...
This article is a brief review of dry etching as applied to pattern transfer, primarily in silicon t...
This paper presents guidelines for the deep reactive ion etching (DRIE) of silicon MEMS structures, ...
Thesis: S.M., Massachusetts Institute of Technology, Department of Electrical Engineering and Comput...
An intensive study has been performed to understand and tune deep reactive ion etch (DRIE) processes...
The suitability of different plasma etch models based on various plasma chemistry has been evaluated...
Dry Etching is widely used in nanoprocessing as a method of pattern transfer onto a hard substrate, ...
Dry etching of silicon is an important process in the manufacturing of integrated circuits and micro...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
This article is a brief review of dry etching as applied to pattern transfer, primarily in silicon t...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
This bachelor thesis deals with optimization of cryogenic and Bosch deep reactive ion etching (DRIE)...
This article is a brief review of dry etching as applied to pattern transfer, primarily in silicon t...
This paper presents guidelines for the deep reactive ion etching (DRIE) of silicon MEMS structures, ...
Thesis: S.M., Massachusetts Institute of Technology, Department of Electrical Engineering and Comput...
An intensive study has been performed to understand and tune deep reactive ion etch (DRIE) processes...
The suitability of different plasma etch models based on various plasma chemistry has been evaluated...
Dry Etching is widely used in nanoprocessing as a method of pattern transfer onto a hard substrate, ...
Dry etching of silicon is an important process in the manufacturing of integrated circuits and micro...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
This article is a brief review of dry etching as applied to pattern transfer, primarily in silicon t...
Conventional Deep Reactive Ion Etching (DRIE) is a plasma etch process with alternating half-cycles ...
This bachelor thesis deals with optimization of cryogenic and Bosch deep reactive ion etching (DRIE)...
This article is a brief review of dry etching as applied to pattern transfer, primarily in silicon t...