Abstract – In the sub-65 nm CMOS technologies, subthreshold and gate dielectric leakage currents need to be simultaneously suppressed for effective energy reduction. New low-leakage circuit techniques based on multi-threshold-voltage (multi-Vt) and multi-oxide-thickness (multi-tox) standard single-gate and emerging double-gate MOSFET/FinFET technologies are presented in this paper. The leakage savings achieved with the techniques are characterized for a diverse set of logic and memory circuits that are widely used in systems-on-chips. The speed, active power, noise immunity, and area tradeoffs with the leakage reduction schemes are also evaluated. I
Minimizing dynamic power consumption in digital circuits was the primary design objective in most of...
CMOS devices have been scaled down aggressively in last few decades resulting in higher integration ...
High leakage current in deep-submicrometer regimes is be-coming a significant contributor to power d...
In the sub-65 nm CMOS technologies, subthreshold and gate dielectric leakage currents need to be sim...
Power dissipation is a key consideration in the design of nano-scale CMOS VLSI circuits. Various tec...
High leakage current in deep sub-micron regimes is a significant contributor to the power dissipatio...
With aggressive scaling of device dimensions, threshold voltages and oxide-thicknesses, leakage-powe...
Design of systems in the low-end nanometer domain has introduced new dimensions in power consumption...
With aggressive scaling of device dimensions, threshold voltages and oxide-thicknesses, leakage-powe...
Temperature-dependent subthreshold and gate-oxide leakage power characteristics of domino logic circ...
Abstract: This paper presents a comprehensive study of leakage reduction techniques applicable to CM...
An electronic system/appliance/portable device with high speed, low power, and feasible area has bec...
Because of the continued scaling of technology and supply-threshold voltage, leakage power has becom...
Enabled by technology scaling, ultra low-voltage devices have now found wide application in modern V...
CMOS technology has scaled aggressively over the past few decades in an effort to enhance functional...
Minimizing dynamic power consumption in digital circuits was the primary design objective in most of...
CMOS devices have been scaled down aggressively in last few decades resulting in higher integration ...
High leakage current in deep-submicrometer regimes is be-coming a significant contributor to power d...
In the sub-65 nm CMOS technologies, subthreshold and gate dielectric leakage currents need to be sim...
Power dissipation is a key consideration in the design of nano-scale CMOS VLSI circuits. Various tec...
High leakage current in deep sub-micron regimes is a significant contributor to the power dissipatio...
With aggressive scaling of device dimensions, threshold voltages and oxide-thicknesses, leakage-powe...
Design of systems in the low-end nanometer domain has introduced new dimensions in power consumption...
With aggressive scaling of device dimensions, threshold voltages and oxide-thicknesses, leakage-powe...
Temperature-dependent subthreshold and gate-oxide leakage power characteristics of domino logic circ...
Abstract: This paper presents a comprehensive study of leakage reduction techniques applicable to CM...
An electronic system/appliance/portable device with high speed, low power, and feasible area has bec...
Because of the continued scaling of technology and supply-threshold voltage, leakage power has becom...
Enabled by technology scaling, ultra low-voltage devices have now found wide application in modern V...
CMOS technology has scaled aggressively over the past few decades in an effort to enhance functional...
Minimizing dynamic power consumption in digital circuits was the primary design objective in most of...
CMOS devices have been scaled down aggressively in last few decades resulting in higher integration ...
High leakage current in deep-submicrometer regimes is be-coming a significant contributor to power d...