iii As feature sizes scale toward atomic limits, parameter variation continues to increase, leading to increased margins in both delay and energy. Parameter variation both slows down devices and causes devices to fail. For applications that require high performance, the possibility of very slow devices on critical paths forces designers to reduce clock speed in order to meet timing. For an important and emerging class of applications that target energy-minimal operation at the cost of delay, the impact of variation-induced defects at very low voltages mandates the sizing up of transistors and operation at higher voltages to maintain functionality. With post-fabrication configurability, FPGAs have the opportunity to self-measure the impact o...
For field-programmable gate arrays (FPGAs), fine-grained pre-computed alternative configurations, co...
Abstract—Aggressive device size scaling combined with Vdd and Vth scaling lead to increasing circuit...
Excessive power dissipation causes overheating, which can lead multiple impacts like, packaging cost...
As feature sizes scale toward atomic limits, parameter variation continues to increase, leading to i...
Chip design in the nanometer regime is becoming increasingly difficult due to process variations. AS...
ABSTRACT Chip design in the nanometer regime is becoming increasingly difficult due to process varia...
Continued miniaturization of semiconductor technology to nanoscale dimensions has elevated reliabili...
Efficient power management is becoming increasingly important with the rapid growth of portable, wir...
The demand for richer services, multifunctional portable devices and high data rates can be only env...
Circuit variation is one of the biggest problems to overcome if Moore\u27s Law is to continue. It is...
Circuit variation is one of the biggest problems to overcome if Moore\u27s Law is to continue. It is...
Parameter variations, which are increasing along with advances in process technologies, affect both...
Abstract—Reconfigurable hardware platforms, such as Field Pro-grammable Gate Arrays (FPGA), are bein...
nique for reducing power in field-programmable gate arrays (FPGAs) by eliminating unnecessary logic ...
For field-programmable gate arrays (FPGAs), fine-grained pre-computed alternative configurations, co...
For field-programmable gate arrays (FPGAs), fine-grained pre-computed alternative configurations, co...
Abstract—Aggressive device size scaling combined with Vdd and Vth scaling lead to increasing circuit...
Excessive power dissipation causes overheating, which can lead multiple impacts like, packaging cost...
As feature sizes scale toward atomic limits, parameter variation continues to increase, leading to i...
Chip design in the nanometer regime is becoming increasingly difficult due to process variations. AS...
ABSTRACT Chip design in the nanometer regime is becoming increasingly difficult due to process varia...
Continued miniaturization of semiconductor technology to nanoscale dimensions has elevated reliabili...
Efficient power management is becoming increasingly important with the rapid growth of portable, wir...
The demand for richer services, multifunctional portable devices and high data rates can be only env...
Circuit variation is one of the biggest problems to overcome if Moore\u27s Law is to continue. It is...
Circuit variation is one of the biggest problems to overcome if Moore\u27s Law is to continue. It is...
Parameter variations, which are increasing along with advances in process technologies, affect both...
Abstract—Reconfigurable hardware platforms, such as Field Pro-grammable Gate Arrays (FPGA), are bein...
nique for reducing power in field-programmable gate arrays (FPGAs) by eliminating unnecessary logic ...
For field-programmable gate arrays (FPGAs), fine-grained pre-computed alternative configurations, co...
For field-programmable gate arrays (FPGAs), fine-grained pre-computed alternative configurations, co...
Abstract—Aggressive device size scaling combined with Vdd and Vth scaling lead to increasing circuit...
Excessive power dissipation causes overheating, which can lead multiple impacts like, packaging cost...