Devices Patterning of Electrical Circuits on Fluidic Assembly Microtiles

As an alternative to pick-and-place assembly techniques, recent research has lead to the development of microelectro-mechanical systems (MEMS) components that assemble spontaneously in fluid [1-3]. These efforts have relied heavily on surface-energy minimization and therefore work best when components are assembled by vertical stacking to obtain a product with multiple layers. Our research provides an alternative method for interfacing MEMS components assembled in fluid, which involves horizontal (in-plane) assembly. Our previous work has produced silicon microtiles with mechanical latches that can be manipulated by controlling local fluidic forces in a microchamber [4]. The goal of this research was to demonstrate electrical connection between tiles in a single plane. This was achieved by patterning tiles with gold electrodes so that their tops and sidewalls had a continuous covering of conductive material. The result of this research is a novel method for the electrical interfacing of fluidically-assembled MEMS components. Background Past research includes fabrication and testing a series of latching silicon microtiles of varying sizes that can be controlled and assembled in a microfluidic channel. The microtiles are manipulated by controlling the fluid flow through