A scalable frequency-division multiple access interconnect (FDMA-I) system is proposed to enable reconfigurable and bi-directional multiple I/O chip-to-chip communications. By trans-mitting signals using N-orthogonal frequency channels, this FDMA-I achieves simultaneous multi-chip access capability between NxN I/Os on a shared bus by selectively switching vari-ous frequency bands, resulting in channel concurrency and recon-figurability. In the past, CDMA techniques have been applied in serial links [1,2] and bus architectures [3,4] to achieve a flexible communica-tion network. However, ISI makes it difficult to increase the data rate for these schemes. FDMA-I, on the other hand, can achieve the same flexible and reconfigurable I/O network w...
Abstract — OFDM is a special case of multi-carrier modulations, which is of great use in various wir...
Traditionally, hams have wired together multiple standard integrated circuits to construct radios, T...
International audience—In this paper we size a RF intra-chip communications based on Orthogonal Freq...
fulfills the demands of future high speed, fault tolerant and smart interconnect systems is presente...
The need for efficient interconnect architectures beyond the conventional time-division multiplexing...
International audience— This paper introduces flexible radio techniques inside integrated circuits i...
International audienceA paradigm shift is apparent in Chip Multiprocessor (CMP) design, as the new p...
International audienceChip Multiprocessors (CMPs) composed of more than 1000 cores are expected to b...
Abstract—Future inter- and intra-ULSI interconnect systems demand extremely high data rates (up to 1...
On-chip communication system has emerged as a prominently important subject in Very-Large- Scale-Int...
International audienceWith the growing number of cores on chips, conventional electrical interconnec...
In this paper, we propose a new way of implementing on-chip global interconnect that would meet stri...
The growing number of cores in a single chip goes along with an increase in com-munications. The var...
La multiplication du nombre de cœurs de calcul présents sur une même puce va depair avec une augment...
In the earlier days of the Complementary Metal Oxide Semiconductor (CMOS) industry, much effort was ...
Abstract — OFDM is a special case of multi-carrier modulations, which is of great use in various wir...
Traditionally, hams have wired together multiple standard integrated circuits to construct radios, T...
International audience—In this paper we size a RF intra-chip communications based on Orthogonal Freq...
fulfills the demands of future high speed, fault tolerant and smart interconnect systems is presente...
The need for efficient interconnect architectures beyond the conventional time-division multiplexing...
International audience— This paper introduces flexible radio techniques inside integrated circuits i...
International audienceA paradigm shift is apparent in Chip Multiprocessor (CMP) design, as the new p...
International audienceChip Multiprocessors (CMPs) composed of more than 1000 cores are expected to b...
Abstract—Future inter- and intra-ULSI interconnect systems demand extremely high data rates (up to 1...
On-chip communication system has emerged as a prominently important subject in Very-Large- Scale-Int...
International audienceWith the growing number of cores on chips, conventional electrical interconnec...
In this paper, we propose a new way of implementing on-chip global interconnect that would meet stri...
The growing number of cores in a single chip goes along with an increase in com-munications. The var...
La multiplication du nombre de cœurs de calcul présents sur une même puce va depair avec une augment...
In the earlier days of the Complementary Metal Oxide Semiconductor (CMOS) industry, much effort was ...
Abstract — OFDM is a special case of multi-carrier modulations, which is of great use in various wir...
Traditionally, hams have wired together multiple standard integrated circuits to construct radios, T...
International audience—In this paper we size a RF intra-chip communications based on Orthogonal Freq...