Abstract—Various aspects of ultra-low leakage static random-access memories (SRAM) cell design are considered. It is shown that the high threshold voltage relative to the power supply so improves the stability of the cell that the beta ratio of the design may be made very small for improved performance. Also, the ramifications of threshold uncertainty due to random dopant fluctuations are investigated, and it is shown that chip performance will be adversely affected by this phenomenon. Index Terms—CMOSFETS, CMOS memory integrated circuits, random access memory (RAM). I
The semiconductor electronic industry is advancing at a very fast pace. The size of portable and han...
The paper presents a variability-aware modified 9T SRAM cell. In comparison to 6T SRAM cell the prop...
In this paper, two static random access memory (SRAM) cells that reduce the static power dissipation...
Abstract—Semiconductor manufacturing process scaling increases leakage and transistor variations, bo...
Aggressive CMOS scaling results in lower threshold voltage and thin oxide thickness for transistors\...
The requirement for smaller, lighter yet increasingly powerful electronic devices has never been gre...
As CMOS technology continuously scales, the process variability becomes a major challenge in designi...
The reduction of the channel length due to scaling increases the leakage current resulting in a majo...
With the development of CMOS technology, the performance including power dissipation and operation s...
Abstract-Low power design has become the major challenge of present chip designs as leakage power ha...
An ultra-low leakage static random-access memory (SRAM) cell structure with 8 transistors is propose...
Power Stringent Static Random Access Memory (SRAM) design is very much essential in embedded system...
Abstract—The increased importance of lowering power in memory design has produced a trend of operati...
[[abstract]]© 2006 Institute of Electrical and Electronics Engineers-This paper highlights the cell ...
Aggressive scaling of transistor dimensions with each technology generation has resulted in increase...
The semiconductor electronic industry is advancing at a very fast pace. The size of portable and han...
The paper presents a variability-aware modified 9T SRAM cell. In comparison to 6T SRAM cell the prop...
In this paper, two static random access memory (SRAM) cells that reduce the static power dissipation...
Abstract—Semiconductor manufacturing process scaling increases leakage and transistor variations, bo...
Aggressive CMOS scaling results in lower threshold voltage and thin oxide thickness for transistors\...
The requirement for smaller, lighter yet increasingly powerful electronic devices has never been gre...
As CMOS technology continuously scales, the process variability becomes a major challenge in designi...
The reduction of the channel length due to scaling increases the leakage current resulting in a majo...
With the development of CMOS technology, the performance including power dissipation and operation s...
Abstract-Low power design has become the major challenge of present chip designs as leakage power ha...
An ultra-low leakage static random-access memory (SRAM) cell structure with 8 transistors is propose...
Power Stringent Static Random Access Memory (SRAM) design is very much essential in embedded system...
Abstract—The increased importance of lowering power in memory design has produced a trend of operati...
[[abstract]]© 2006 Institute of Electrical and Electronics Engineers-This paper highlights the cell ...
Aggressive scaling of transistor dimensions with each technology generation has resulted in increase...
The semiconductor electronic industry is advancing at a very fast pace. The size of portable and han...
The paper presents a variability-aware modified 9T SRAM cell. In comparison to 6T SRAM cell the prop...
In this paper, two static random access memory (SRAM) cells that reduce the static power dissipation...